Robert Boschgmbh

Franziska Rohlfing

Thomas Friedrich

Friedjof Heuck

Christoph Schelling

Stefan Pinter

Frank Schatz

Fabian Purkl

Peter Schmollngruber

Christian Doering

Volkmar Senz

Kerrin Doessel

Robert Roelver

Jochen Tomaschko

Daniel Pantel

Timo Lindemann

Theresa Lutz

Johannes Kenntner

Juergen Bowe

Martin Christoph Geisler

Andreas Burg

A method for producing a wafer connection between a first and a second wafer. The method includes providing a first and second material for forming a eutectic alloy, providing a first wafer having a receiving structure for a die structure, filling the receiving structure with the first material, providing a second wafer having a die structure, the second material being situated on the die structure, providing a stop structure on the first and/or second wafer, so that when the two wafers are joined, a defined stop is provided, heating the first and second material at least to the eutectic temperature of the eutectic alloy, joining the first and second wafer so that the die structure is at least partly introduced into the receiving structure, the stop structure, the receiving structure, the die structure.

Method for producing a wafer connection

A micromechanical sensor device and a corresponding production method, in which the micromechanical sensor device is equipped with a sensor substrate having a front side and a rear side, a sensor region provided on the front side that can be brought into contact with an environmental medium, and a capping device, attached on the front side, for capping the sensor region. In the capping device and/or in the sensor substrate, one or more capillaries are formed for conducting the environmental medium onto the sensor region, a liquid-repellent layer being provided at least in some regions on the inner walls of the capillaries.

Micromechanical sensor device with improved liquid tightness protection

A production method for a layer structure, including providing a substrate, wherein at least a top surface of the substrate is made from a non-conductive material; depositing a catalyst structure onto the top surface of the substrate; depositing a graphene structure onto the catalyst structure; and at least partially removing the catalyst structure situated between the substrate and the graphene structure.

Production method for a layer structure and layer structure

An assembly body for micromirror chips that partly encloses an internal cavity, the assembly body including at two sides oriented away from one another, at least one respective partial outer wall that is fashioned transparent for a specified spectrum, and the assembly body having at least one first outer opening on which a first micromirror chip can be attached, and a second outer opening on which a second micromirror chip can be attached, in such a way that a light beam passing through the first partial outer wall is capable of being deflected by the first micromirror chip onto the second micromirror chip, and is capable of being deflected by the second micromirror chip through the second partial outer wall. A mirror device and a production method for a mirror device are also described.

Assembly body for micromirror chips, mirror device and production method for a mirror device

Growing community of inventors

Leonberg, Germany

Franziska Rohlfing