Robert Boschgmbh

Robert Bosch Gmbh

Franz Wetzl

Werner Herden

Helmut Weyl

Juergen Raimann

Pascal Woerner

Martin Weinrotter

Manfred Schmitt

Joerg Engelhardt

Stephan Leuthner

Juergen Hackenberg

Karl-Heinz Nuebel

Stefan Henneck

Martin Rittner

Martin Koehne

Michael Guyenot

Michael Guenther

Volker Henrichs

Rainer Holz

Thomas Kalich

Wilfried Reschnar

Friedrich Kneule

Andreas Fix

Christiane Frueh

Patrick Glaser

Ilona Krinn

Andrea Feiock

Marco Gueth

Winfried Ziegler

Stephan Borges

Bernd Hohenberger

Philipp Krueger

Miroslaw Brzoza

The invention proposes a method for connecting plate-like components of a bipolar plate, comprising the steps of placing a first plate-like component on a clamping surface, placing a second plate-like component onto the first plate-like component, fitting a plurality of hold-down devices on an outer surface of the second plate-like component, said outer surface facing away from the first plate-like component and the clamping surface, wherein an envisaged seam line is kept free between the hold-down devices, pressing of the plate-like components together using all of the hold-down devices, wherein, for this purpose, a magnetic force acting in the direction of the clamping surface is applied to at least one of the hold-down devices, and welding the plate-like components along the seam line in a continuous operation.

Method and system for connecting plate-like components of a bipolar plate

Laminated composite () comprising at least one electronic substrate () and an arrangement of layers () made up of at least a first layer () of a first metal and/or a first metal alloy and of a second layer () of a second metal and/or a second metal alloy adjacent to this first layer (), wherein the melting temperatures of the first and second layers are different, and wherein, after a thermal treatment of the arrangement of layers (), a region with at least one intermetallic phase () is formed between the first layer and the second layer, wherein the first layer () or the second layer () is formed by a reaction solder which consists of a mixture of a basic solder with an AgX, CuX or NiX alloy, wherein the component X of the AgX, CuX or NiX alloy is selected from the group consisting of B, Mg, Al, Si, Ca, Se, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Y, Zr, Nb, Mo, Ag, In, Sn, Sb, Ba, Hf, Ta, W, Au, Bi, La, Ce, Pr, Nd, Gd, Dy, Sm, Er, Tb, Eu, Ho, Tm, Yb and Lu and wherein the melting temperature of the AgX, CuX or NiX alloy is greater than the melting temperature of the basic solder. The invention also relates to a method for forming a laminated composite () and to a circuit arrangement containing a laminated composite () according to the invention.

Laminated composite made up of an electronic substrate and a layer arrangement comprising a reaction solder

An ignition laser, includes a laser-active solid-state body, a housing and a combustion chamber window, the housing having an inner sleeve and an outer sleeve. An insert is provided between the inner sleeve and the outer sleeve, the insert and the combustion chamber window being joined sealingly and integrally.

Ignition laser

A method for producing a component out of stacked plates ( ) soldered to one another, into at least some of which recesses ( ) are made, is proposed, in which at least one solder layer ( ) is provided between the plates ( ) for a solder diffusion process. According to the invention, the plates ( ), with solder layers ( ) between them, are stacked on one another and compressed in the cold state before the solder diffusion process. With this provision, the use of complicated pressing tools in the actual solder diffusion process is avoided.

Method for producing a structural member from plates stacked on top of each other and soldered together

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Mundelsheim, Germany

Franz Wetzl