Carl Zeiss Smt Gmbh

Carl-zeiss-smt Ag

Asml Netherlands B.v.

Carl-zeiss-stiftung

Franz Sorg

Jens Kugler

Andreas Wurmbrand

Thomas Ittner

Thomas Schletterer

Bernhard Geuppert

Toralf Gruner

Bernhard Gellrich

Stefan Xalter

Ulrich Loering

Yim-Bun Patrick Kwan

Peter Deufel

Karl-Heinz Schuster

Norbert Wabra

Ulrich Wegmann

Ulrich Weber

Frank Melzer

Albrecht Ehrmann

Bernhard Kneer

Rainer Hoch

Joerg Mallmann

Aksel Goehnermeier

Armin Schoeppach

Siegfried Wahl

Stefan Hembacher

Dirk Schaffer

Thomas Petasch

Guido Limbach

Julian Kaller

Dirk Hellweg

Michael Muehlbeyer

Ralf Winter

Karl-Stefan Weissenrieder

Peter Meyer

Erik Roelof Loopstra

Johannes Lippert

Bernardus Antonius Johannes Luttikhuis

Nils Dieckmann

Alexander Wolf

Michael Trunz

Laurentius Catrinus Jorritsma

Adrianus Franciscus Petrus Engelen

Johannes Wilhelmus De Klerk

Willi Heintel

Andreas Frommeyer

Aart Adrianus Van Beuzekom

Maria Johanna Agnes Rubingh

Harald Kirchner

Peter Schaap

Johannes Martinus Andreas Hazenberg

Michael Mühlbeyer

Frank Marianek

Wolfgang Keller

Karlfried Osterried

Markus Kasparek

Christian Holland

Hans-Jürgen Scherle

Fraser G Morrison

Petrus Franciscus Wilhelmus Maria Mandigers

Michael Ebert

Aksel Göhnermeier

An optical assembly includes: an optical element, which is transmissive or reflective to radiation at a used wavelength and has an optically used region; and a thermally conductive component, which is arranged outside the optically used region of the optical element. The thermally conductive component can include a material having a thermal conductivity of more than 500 W mK. Additionally or alternatively, the product of the thickness of the thermally conductive component in millimeters and the thermal conductivity of the material of the thermally conductive component is at least 1 W mm mK.

Optical assembly having a thermally conductive component

The disclosure relates to a microlithography projection exposure system having optical corrective elements configured to modify the imaging characteristics, as well as related systems and component.

Method and device for the correction of imaging defects

A microlithographic projection exposure apparatus includes a projection lens that is configured for immersion operation. For this purpose an immersion liquid is introduced into an immersion space that is located between a last lens of the projection lens on the image side and a photosensitive layer to be exposed. To reduce fluctuations of refractive index resulting from temperature gradients occurring within the immersion liquid, the projection exposure apparatus includes heat transfer elements that heat or cool partial volumes of the immersion liquid so as to achieve an at least substantially homogenous or at least substantially rotationally symmetric temperature distribution within the immersion liquid.

Microlithographic projection exposure apparatus and measuring device for a projection lens

An optical module includes: a first holding device with a circumference extending in a first circumferential direction; and a plurality of first supporting devices configured to support a first optical element, the first supporting devices being fixed at the circumference of the first holding device. Along the first circumferential direction, at least one of the first supporting devices is located in a non-equidistant manner between two neighboring first supporting devices. The optical module is configured to be used in a microlithography objective.

Optical module for a microlithography objective holding optical elements with supporting devices located in a non-equidistant manner

An optical module is configured to be used in a microlithography objective. The optical module includes a first holding device with a circumference extending in a first circumferential direction and a first supporting device configured to support a first optical element. The first supporting device is fixed at the circumference of the first holding device. The optical module also includes a plurality of second supporting devices configured to support a second optical element, the second supporting devices being fixed at the circumference of the first holding device. The first supporting device does not contact the second supporting devices. The first optical element is separate from the second optical element. Along the first circumferential direction, the first supporting device is located in a non-equidistant manner between two neighboring second supporting devices.

Optical module for a microlithography objective holding optical elements with supporting device located in non-equidistant manner

Exposure apparatus and measuring device for a projection lens

A replacement apparatus for an optical element mounted between two adjacent optical elements in a lithography objective has a holder for the optical element to be replaced, which holder can be moved into the lithography objective through a lateral opening in a housing of the same.

Replacement apparatus for an optical element

There is provided an optical module for an objective. The optical module includes (a) a first holding device with an inner circumference, which extends in a first circumferential direction, (b) at least one first supporting device for supporting a first optical element and being fixed at said inner circumference of said first holding device, (c) an annular circumferential first assembly space being defined by displacing said first supporting device once in a revolving manner along said first circumferential direction, (d) at least one second supporting device being provided for supporting a second optical element and being fixed at said inner circumference of said first holding device, and (e) an annular circumferential second assembly space being defined by displacing said second supporting device once in a revolving manner along said first circumferential direction. The first assembly space intersects the second assembly space.

Optical module for a microlithography objective including holding and supporting devices

The disclosure relates to an optical system, such as a projection exposure apparatus for semiconductor lithography, including a manipulable correction arrangement for reducing image aberrations. In some embodiments, the system includes at least one manipulator configured to reduce image aberrations. The manipulator can include at least one optical element which can be manipulated by at least one actuator. The manipulator can be formed in changeable fashion together with an actuator.

Optical system with an exchangeable, manipulable correction arrangement for reducing image aberrations

The invention relates to a device for the low-deformation replaceable mounting of an optical element, in particular a closure plate of an objective of a projection exposure system for microlithography for the production of semiconductor components, in a mount (). The optical element is connected to the mount () at least partly via an adhesive connection. This is located between the adjacent circumferential walls of mount () and optical element. The mount () is provided with at least three support feet () distributed over the circumference, by means of which the optical element is mounted laterally and axially. The mount () is connected to the housing of the objective in an at least approximately deformation-decoupled manner via three mount bearing points ().

Device for the low-deformation replaceable mounting of an optical element

A projection objective for imaging an object arranged in an object plane of the projection objective into an image of the object lying in an image plane of the projection objective has a multiplicity of transparent optical elements and holding devices for holding the optical elements at prescribable positions along an imaging beam path of the projection objective. Each of the optical elements has an optical useful region lying in the imaging beam path and an edge region lying outside the optical useful region. At least one holding element of the holding device assigned to the optical element acts at the edge region in the region of a contact zone. At least one of the optical elements is assigned a diaphragm arrangement with a false light diaphragm arranged directly upstream of the optical element and a second false light diaphragm arranged directly downstream of the optical element. Each of the false light diaphragms is fashioned in such a way that the false light diaphragm screens at least a part of the edge region against radiation running outside the imaging beam path.

Projection objective with diaphragms

Growing community of inventors

Aalen, Germany

Franz Sorg