Other

Thyssen Laser-Technik Gmbh

Reis Gmbh & Co., Maschinenfabrik

Reis Group Holding Gmbh & Co. Kg

Reis Gmbh & Co. Kg Maschinenfabrik

Franz Som

Wolfgang Zesch

Eberhard Kroth

Friedrich Behr

Axel Fischer

Olaf Ziegler

Georg Berberich

Stefan Seiler

Günter Neumann

Rolf P Maisch

Peter Laumeister

In a method for robot-controlled cutting of workpieces to be joined by laser radiation, a first workpiece is arranged in vicinity of a second workpiece in a first position. A laser is focused onto the first workpiece. A contour of the first workpiece is cut with the laser beam; this contour is to be assembled and joined with the second workpiece. During cutting, a first spacing of a focal point of the laser beam from the second workpiece is repeatedly determined in a distance direction that is identically oriented during cutting and is adjusted to a direction of assembling the first and second workpieces. During cutting, a second spacing of a processing point of the laser beam from the second workpiece is maintained at a constant value.

Method and device for the robot-controlled cutting of workpieces to be assembled by means of laser radiation

The present invention relates to a monitoring and control device for monitoring a technical system having at least one portable and/or mobile and/or immobile device, and more specifically, a handling device that is a arranged in a protective device, and further including at least one preferably central or decentralized control unit and actuators connected thereto to carry out dangerous actions.

Monitoring and control of a handling device

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Lützelbach, Germany

Franz Som