Wacker-chemitronic Gesellschaft Fur Elektronik-grundstoffe Mbh

Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag

Franz Segieth

Wilfried Von Ammon

Erich Dornberger

Hans Oelkrug

Hans Olkrug

Peter Gerlach

Device for pulling a silicon single crystal 1 includes an element 5 which annularly surrounds the single crystal growing at a crystallization boundary; and the element has a face 6 directed at the single crystal. The element surrounds the single crystal substantially level with the crystallization boundary 2 and has the property of reflecting heat radiation radiated by the single crystal and the similar melt or of generating and radiating heat radiation back to the lower part of the crystal close to the crystallization boundary. There is also a method for pulling a silicon single crystal, in which the single crystal is thermally affected using the element surrounding it.

Device and method for pulling a single crystal

A method for pulling a silicon single crystal has the single crystal being pulled at a speed defined as maximum pulling speed in the vertical direction with respect to a silicon melt held in a crucible. The value of the maximum pulling speed is approximately proportional to the axial temperature gradient in the growing single crystal.

Method for pulling a silicon single crystal

A process and an apparatus reduces the oxygen incorporation into a single crystal of silicon which is drawn by the Czochralski method. If a molding is immersed at least temporarily in the melt between the single crystal and the crucible wall during drawing of the single crystal, the oxygen content of the single crystal is reduced compared with the oxygen content of a single crystal which has been drawn without the use of the molding.

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Kirchham, Germany

Franz Segieth