Epcos Ag

Tdk Electronics Ag

At&s Austria Technologie & Systemtechnik Aktiengesellschaft

Tdk Electroncis Ag

Epos Ag

Franz Rinner

Christoph Auer

Dieter Somitsch

Markus Puff

Reinhard Gabl

Markus Koini

Thomas Feichtinger

Martin Galler

Pavol Kudela

Thomas Wippel

Georg Kuegerl

Jürgen Konrad

Jan-Thorsten Reszat

Monika Stadlober

Manfred Schweinzger

Alfred Hofrichter

Hermann Grünbichler

Masahiro Oishi

Alexander Melischnig

Christian Hoffmann

Sebastian Brunner

Christian Vockenberger

Marion Ottlinger

Bernhard Döllgast

Oliver Dernovsek

Michael Weilguni

Harald Kastl

Georg Kügerl

Johann Pichler

Yongli Wang

Herbert Thanner

Stefan Obermair

Shaoyu Sun

Volker Wischnat

Siegfried Fellner

Danilo Suvorov

Gerhard Fuchs

Markus Laussermayer

Alenko Lic

Stefan Koestner

Johann Ramler

Markus Weiglhofer

Yihai Sun

Werner Rollett

Jaromir Kotzurek

Juergen Konrad

Stefan Köstner

Damjan Vengust

Bostjan Jancar

Herbert J Thanner

In an embodiment a method for manufacturing a multilayer varistor includes providing a first ceramic powder for producing a first ceramic material and at least one second ceramic powder for producing a second ceramic material, wherein the ceramic powders differ from each other in concentration of monovalent elements Xby 50 ppm≤Δc(X)≤5000 ppm, wherein X=(Li, Na, Kor Ag), and wherein Δc denotes a maximum concentration difference occurring between an active region and a near-surface region of the multilayer varistor, slicking of the ceramic powders and forming of green films, partially printing of a part of the green films with a metal paste to form inner electrodes, stacking printed and unprinted green films, laminating, decarbonizing and sintering the green films and applying outer electrodes.

Multilayer varistor and method for manufacturing a multilayer varistor

An electrical component comprises a main body and at least one external electrode that is fastened by a connecting material to the main body. The main body and the external electrode have different coefficients of thermal expansion that determine a critical temperature which, when exceeded, results in a connection between the main body and the external electrode experiencing mechanical stresses that lead to damage to the component. The connecting material has a melting point which is lower than a critical temperature.

Thermistor, varistor or capacitor component with a fusible connecting element between the main body of the component

A circuit board having a power supply, an electrical device having a circuit board, and a method for producing a circuit board are disclosed. In an embodiment a circuit board includes a power supply, a carrier substrate and an energy store with a first layer stack having a first electrode layer with a first electrode, a second electrode layer with a second electrode, and an electrolyte layer arranged therebetween, which has an electrolyte, wherein the first electrode, the second electrode and the electrolyte are solid states.

Circuit board having power supply, electrical device having circuit board, and method for producing a circuit board

An electrical circuit and a method for using the electrical circuit are disclosed. In an embodiment an electrical circuit includes an energy transducer, an energy storage system, a first terminal and a second terminal, wherein the energy transducer is electrically coupled with the first and second terminals, wherein the energy storage system is electrically coupled with the first and second terminals, wherein the energy transducer is configured to charge the energy storage system at discrete time intervals, wherein the energy storage system is configured to provide energy continuously, wherein the energy transducer includes a solar cell, and wherein the energy storage system includes a solid-state storage battery.

Electrical circuit and use of the electrical circuit

An LED module is disclosed. In an embodiment an LED module includes a thermally conductive substrate made of a multilayer ceramic, at least one LED on the substrate, passive SMD components arranged on the substrate, a passive component integrated in the substrate and a heat spreader configured to dissipate waste heat in horizontal and vertical directions.

LED module

An apparatus for producing haptic feedback and an electronic device are disclosed. In an embodiment an apparatus includes a piezoelectric actuator and a mechanical structure, wherein the piezoelectric actuator is configured to modify its extension in a first direction, and wherein the mechanical structure is configured to deform as a result of a change in the extension of the piezoelectric actuator in such a way that an area of the mechanical structure is moved in relation to the piezoelectric actuator in a second direction which is perpendicular to the first direction.

Apparatus for producing haptic feedback and electronic device

A multilayer component is disclosed. In an embodiment, a multilayer component includes a main body with first and second inner electrodes, wherein the first and second electrodes are alternately arranged in an interior of the main body and electrically insulated from one another and an outer contact configured to provide external contact, wherein the outer contact comprises at least two first strip-shaped conductor tracks arranged on a first surface of the main body, wherein each first conductor track is electrically connected to one of the first inner electrodes, wherein the outer contact comprises at least two second strip-shaped conductor tracks arranged on a second surface of the main body, wherein each second conductor track is electrically connected to one of the second inner electrodes, and wherein embossings in adjacent first conductor tracks or second conductor tracks are arranged offset with respect to one another.

Multilayer component with external contact

An electrical component having partial bodies, a base on which the partial bodies are arranged, and at least one connection contact for electrically connecting the partial bodies to a carrier. A method for producing an electrical component having one or more partial bodies is also disclosed.

Electrical component and a method for producing an electrical component

An electronic component is disclosed. In an embodiment, an electronic component includes at least one NTC element and at least two electrically conductive contact elements, wherein the NTC element is electrically conductively connected to a respective contact element via a connection material, and wherein a coefficient of thermal expansion of the contact elements is adapted to a coefficient thermal expansion of the NTC element.

Electronic component for limiting the inrush current

The present invention relates to a component () for generating active haptic feedback, comprising a main body () having first and second internal electrodes () stacked one above another in a stacking direction (S), wherein a respective piezoelectric layer () is arranged between the internal electrodes (), wherein the component () is configured to identify a force exerted on the component (), wherein the component () is configured to generate active haptic feedback if a force exerted on the component () is identified, and wherein the haptic feedback is generated by virtue of an electrical voltage being applied between the first and second internal electrodes (), said electrical voltage resulting in a change in length of the main body ().

Component for producing active haptic feedback

The invention relates to a piezoelectric transformer having a piezoelectric element () of the length L, wherein an input voltage Ucan be applied on an input side () for being transformed into an output voltage Uon the output side () according to a transformation ratio U/U=K. The piezoelectric element () comprises multiple plies () of inner electrodes, which are arranged in multiple different layers (S, S, S). Each ply () of inner electrodes extends along at least one predetermined sub-section of a predetermined length, wherein sub-sections of plies () of a first group of layers (S, S) and sub-sections of plies () of a second group of layers (S) have different dimensions, so that the piezoelectric transformer satisfies the following condition: C&#x2264;NC, wherein Cindicates the input capacitance, Cindicates the output capacitance, and N indicates the transformation ratio of the ideal transformer.

Piezoelectric transformer

An NTC ceramic part, an electronic component for inrush current limiting, and a method for manufacturing an electronic component are disclosed. In an embodiment, an NTC ceramic part for use in an electronic component for inrush current limiting is disclosed, wherein the NTC ceramic part has an electrical resistance in the m&#x3a9; range at a temperature of 25&#xb0; C. and/or at room temperature.

NTC ceramic part, electronic component for inrush current limiting, and method for manufacturing an electronic component

A piezoelectric transformer is disclosed In an embodiment a piezoelectric transformer includes a cylindrical base body with an input region and an output region, wherein a cylinder axis of the base body extends in a longitudinal direction, wherein the input region is configured to convert an AC voltage into a mechanical vibration, wherein the output region is configured to convert a mechanical vibration into an electrical voltage, wherein the output region includes a single piezoelectric layer polarized in the longitudinal direction, wherein, in the input region, a first piezoelectric layer, on which a first internal electrode is arranged, and a second piezoelectric layer, on which a second internal electrode is arranged, are wound onto one another, and wherein the first piezoelectric layer and the second piezoelectric layer are polarized in a radial direction which is perpendicular to the longitudinal direction.

In an embodiment a device includes at least one piezoelectric actuator including a plurality of piezoelectric layers and a first reinforcing element and a second reinforcing element, wherein the piezoelectric actuator is arranged between the reinforcing elements, wherein the piezoelectric actuator is configured to alter its expansion in a first direction when an electrical voltage is applied, and wherein the reinforcing elements are configured to deform on account of a change in an expansion of the piezoelectric actuator such that a central region of the respective reinforcing element is moved relative to the piezoelectric actuator in a second direction, the second direction being perpendicular to the first direction.

Device for producing haptic feedback

The present invention relates to a carrier () with a passive cooling function for a semiconductor component (), having a main body () with a top side () and a bottom side () and at least one electrical component () that is embedded in the main body (), wherein the carrier () has a first thermal via (), which extends from the top side () of the main body () to the at least one electrical component (), wherein the carrier () has a second thermal via (), which extends from the at least one electrical component () to the bottom side () of the main body (), and wherein the at least one embedded electrical component () is electrically contacted by the first and the second thermal via ().

Carrier with a passive cooling function for a semiconductor component

Growing community of inventors

Deutschlandsberg, Austria

Franz Rinner