Robert Boschgmbh

Franz Riedinger

Hans-Peter Trah

Herbert Goebel

Steffen Schmidt

Vesna Biallas

A method of making micromechanical structures from silicon involves cutting a monocrystalline silicon wafer. The orientation of the crystal structure relative to the flat of the wafer is first determined, and this information is taken into account in the subsequent structuring steps.

Method of making micromechanical components

The invention relates to a method for soldering together a first, in particular electrical, component with a second, in particular electrical, component, where a solder preform is disposed between the components and is fixed by pressing it against edges of at least one depression in one of the components to prevent lateral dislocation and where subsequently the soldering process takes place, preferably in a soldering furnace. A special feature is that the depression is formed as grooves (10) extending in a closed loop (11), in particular in the shape of a circle.

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Burladingen, Germany

Franz Riedinger