Balzers Und Leybold Deutschland Holding Ag

Thin Materials Ag

Nissan Chemical Corporation

Thin Materials Gmbh

Franz Richter

Hermann Koop

Bernd Hensel

Friedrich Hofmann

Eberhard Feick

Paul Kaiser

Madeleine Piekass

Andreas Luible

Andreas Gross

A method for mechanically separating a laminar structure from a first carrier assembly, comprising or consisting of a first carrier, wherein the laminar structure comprises a wafer and a second, stretchable carrier is disclosed. Also disclosed are the use of a particular separating aid for separating a laminar structure and a device for carrying out the method.

Method for separating a layer system comprising a wafer by precisely maintaining the position of the separating front

The invention relates to a method for bonding a first surface () and a second surface () by means of an interlayer (), comprising the steps:

Bonding method

In an apparatus for the laser beam exposure of a substrate disc (5), linked block tables (19, 29) are provided, which have each a piezotranslator (24, 31). This makes it possible to perform a fine correction of the movements very rapidly and very precisely.

Apparatus for laser beam exposure of a substrate disc

A vertically disposed drive spindle (5) rotates turntable (6) supporting a substrate (7) at high speed, the turntable having a smaller diameter than the substrate. Coaxial with the turntable (6), a centering ring (10) having a frustoconical inside surface can be raised vertically between a lower and upper position. The latter has on its upper side a greater diameter and on its lower side a smaller diameter than the substrate (7). In its lower position the centering ring (10) is at a distance from a substrate (7) lying on the turntable (6), but in its upper position its inside surface supports the substrate (7) at an axial distance above turntable (6).

Apparatus for laser exposure of a substrate disk and a method for the

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Eichenau, Germany

Franz Richter