Infineon Technologies Ag

Franz Reithner

Michael Larisch

Norbert Martin Haueis

Oskar Neuhoff

Dirk Pikorz

Tobias Gamon

A system produces devices that include a semiconductor part and a non-semiconductor part. A front end is configured to receive a semiconductor part and to process the semiconductor part. A back end is configured to receive the processed semiconductor part and to assemble the processed semiconductor part and a non-semiconductor part into a device. A transfer device is configured to automatically handle the semiconductor part in the front end and to automatically transfer the processed semiconductor part to the back end.

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Heimberg, Germany

Franz Reithner