Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag

Wacker Siltronic Gesellschaft F{umlaut Over (u)}r Halbleitermaterialien Ag

Franz Mangs

Thomas Buschhardt

Anton Schnegg

Rainer Neumann

Manfred Thurner

Paul Muller

Heinrich Hennhofer

Klaus Rottger

Norbert Sickmann

Norbert Franze

Robert Rurlaender

A method of mounting and demounting a semiconductor wafer, in which a temperature dependent adhesive and curable joint is provided by an adhesive mixture between the semiconductor wafer and a carrier plate. The adhesive mixture contains a colophonium resin which is chemically modified and esterified. The cured joint is released with water again after polishing the semiconductor wafer. The adhesive mixture suitable for carrying out the method is this resin with an amine which saponifies the resin.

Adhesive mixture suitable for mounting and demounting a semiconductor wafer

A method is for the polishing of semiconductor wafers, which are mounted on a front side of a support plate and one side face of which is pressed anst a polishing plate, which is covered with a polishing cloth, with a specific polishing pressure and polished. A device is provided which is suitable for carrying out the method. The method includes a) applying a specific pressure to at least one of a plurality of pressure chambers prior to the polishing of the semiconductor wafers, and b) during the polishing of the semiconductor wafers, transmitting the polishing pressure to a rear side of the support plate via elastic bearing surfaces of the pressure chambers to which pressure has been applied.

Method and device for polishing semiconductor wafers

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Tittmoning, Germany

Franz Mangs