Atotech Deutschland Gmbh

Atotech Duetschland Gmbh

Franz Kohnle

Michael Guggemos

Heinrich Meyer

Gonzalo Urrutia Desmaison

Matthias Dammasch

Klaus Hechler

Wolfgang Ptak

To improve the transmission properties of antennae manufactured with known methods, more specifically antennae for application in the UHF range, a method is proposed of producing pattern-forming metal structures on a carrier substrate. The method comprises the following method steps: providing the carrier substrate, forming the pattern on the carrier substrate with a composite material containing dispersed metal, bringing the carrier substrate into contact with halide ions, and thereafter depositing a metal layer onto the pattern formed by the composite material, producing thereby metal structures.

Method of manufacturing pattern-forming metal structures on a carrier substrate

The invention relates to a device and method for electrolytically treating flat work pieces (), more especially for electrolytically treating electrically conductive structures S that are electrically insulated against each other on the surfaces of the work pieces. The method comprises conveying and processing the work pieces () on the conveying paths T', T&#x2033; in the device, said device comprising at least one assembly A located between tow conveying paths, said assembly including a first and a second rotatable contacting electrode () with the contacting electrodes being associated each with one of the conveying paths, and first contacting electrodes () abutting against the work pieces being conveyed in a first conveying path T&#x2032;, and being spaced from the second conveying path T&#x2033; and second contacting electrodes () abutting against the work pieces being conveyed in the second conveying path T&#x2033; and being spaced to the first conveying path T&#x2032;. The assembly and the work pieces are brought into contact with the treatment liquid. The contacting electrodes comprise first and second segments () each that are insulated against each other and that are contacted to a current source () in such a manner that electrolysis areas E are formed between the work piece () being conveyed on the first and second conveying paths T&#x2032;, T&#x2033;, respectively, and second segments () that are turned towards the first and second conveying paths T&#x2032;, T&#x2033; respectively and are not contacting the work pieces ().

Device and method for electrolytically treating flat work pieces

To form a conductive pattern on dielectric substrates, a method is proposed in which a) a substrate covered with a metal film is coated with a protective layer which is formed by treating the metal film with a solution which contains at least one compound containing nitrogen, b) the protective layer is stripped away by UV radiation at least partially in the regions which do not correspond to the conductive pattern to be formed, in such a way that the metal film is exposed, and c) the exposed metal film is then removed by etching. By means of this method, extremely fine conductive patterns can be manufactured in a reproducible manner on dielectric substrates.

Method of forming a conductive pattern on dielectric substrates

Process for manufacturing inductive counting systems

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Berlin, Germany

Franz Kohnle