Enthone Incorporated

Macdermid Enthone Gmbh

Franz-Josef Stark

Christoph Werner

Andreas Möbius

Helmut Horsthemke

Axel Koenig

Ulrich Treuner

A plating formulation for the electroless deposition of a metal layer on a substrate, wherein a &#x3b2;-amino acid and/or &#x3b2;-amino acid derivative is used as a stabilizer. The &#x3b2;-amino acid is present within a range of 1 mg/L to 2 g/L. Typically, the electrolyte is free of heavy metal stabilizers, cyanides, selenium compounds and sulfur compounds comprising sulfur in an oxidation state between &#x2212;2 and +5. The inventive plating formulation can comprise 3-aminopropionic acid, 3-aminobutyric acid, 3-amino-4-methylvaleric acid, and 2-aminoethane-sulfonic acid.

Beta-amino acid comprising plating formulation

The present invention relates to an electrolyte for the electroless deposition of a metal layer on a substrate, wherein the electrolyte is free of heavy metal stabilizers, cyanides, selenium compounds and sulfur compounds comprising sulfur in an oxidation state between &#x2212;2 and +5, and in which instead a &#x3b2;-amino acid is used as stabilizer. In particular, the inventive electrolyte can comprise 3-aminopropionic acid, 3-aminobutyric acid, 3-amino-4-methylvaleric acid, and 2-aminoethane-sulfonic acid. Furthermore, the invention is directed to a method for the electroless deposition of metal layers utilizing an inventive electrolyte as well as the use of &#x3b2;-amino acids as stabilizer in electrolytes for the electroless deposition of metal layers in general.

Method for the deposition of a metal layer comprising a beta-amino acid

Method and plating bath apparatus for setting the ionic strength of a plating composition using Donnan dialysis by flowing the plating composition along a first surface of a membrane while simultaneously flowing a deposition metal ion exchange composition along a second surface of the membrane such that the deposition metal ion crosses the membrane from the deposition metal ion exchange composition to the plating composition while an exchange cation different from the deposition metal ion crosses the membrane from the plating composition to the deposition metal ion exchange composition.

Method for supplying a plating composition with deposition metal ion during a plating operation

The invention concerns an electrolyte for electroless deposition of metal layers with internal compressive stresses containing a metal base salt, a reducing agent, a complexing agent, an accelerator and a stabilizer. In order to make available an electrolyte of the said kind, from which uniform pore-free and crack-free metal-phosphorus coatings can be deposited with constant layers properties and high phosphorus contents at an elevated deposition rate over a long period of time, it is proposed by means of the invention that the electrolyte contain as metal base salt a metal salt whose anions contain at least one carbon atom and that is present in a starting concentration from 0.01 to 0.3 mol/L. At least one salt consisting of metal acetate, metal formate, metal oxalate, metal propionate, metal citrate and metal ascorbate, especially preferably metal acetate, is used as the metal salt whose anion contains at least one carbon atom. In addition, a method that is especially suitable for the use of the said electrolyte is proposed, where this method advantageously has a closed material circulation. Through the use of the invention especially pore-free and crack-free metal coatings with constant layer properties are uniformly deposited over a long time of use of the bath of at least 14-22 MTO.

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Zülpich, Germany

Franz-Josef Stark