Delphi Technologies, Inc.

Delco Electronics Corporation

Heraeus Gmbh

Casantra Acquisition III LLC

Frans Peter Lautzenhiser

John Karl Isenberg

James Edward Walsh

Carl William Berlin

Dwadasi H Sarma

Bradley H Carter

Marion Edmond Ellis

Dwadasi Hare Rama Sarma

Edmar Amaya

Anthony John Stankavich

J Thomas Hochheimer

John Robert Smith

Joel Franklin Downey

Alaa AbdelAzim Elmoursi

Philip Harbaugh Bowles

John D Myers

Bradley R Knigga

Washington Morris Mobley

Fred E Richter

Terrence Evans

Donald A Ozogar

Gary M Gillund

Albert B Campbell

Adam Wade Schubring

Marion Edmund Ellis

The invention concerns a copper-based circuit having an electrically insulative substrate, a bond layer including silver formed over select portions of the substrate according to a desired shape of the circuit, and an electrically conductive layer including plastically deformed particles of copper deposited on the bond layer. Furthermore, the invention also concerns a process for forming a copper-based circuit, wherein the process includes the steps of providing an electrically insulative substrate, forming a bond layer including silver over select portions of the substrate according to a desired shape of the circuit, and depositing copper on the bond layer by the steps of introducing copper particles into a pressurized carrier gas, forming the pressurized carrier gas and the copper particles into a supersonic jet, and directing the jet toward the bond layer formed over the substrate such that the jet has a velocity sufficient to cause plastic deformation of the copper particles onto the bond layer, thereby forming an electrically conductive layer on the bond layer.

Copper circuit formed by kinetic spray

A monolithic self-constrained green body tape for use in low temperature ceramic co-firing is provided. The tape contains at least two layers: one low temperature ceramic layer containing particles of a glass, a ceramic, and an organic binder, and a self-constraining layer containing a refractory ceramic and a wetting agent for the glass in the first layer. When the tape is fired at a sintering temperature of the low temperature ceramic layer, densification occurs in the z (thickness) direction, but essentially no shrinkage (less than about 1%) occurs in the x-y planes. A method for forming a multilayer green body tape using simultaneous wet on wet ceramic slurry deposition is also provided. A dense, monolithic, low temperature, co-fired, self-constrained, multicomponent structure is also provided. The structure contains at least two multilayer ceramic substrates having electronic circuit components mounted thereon or therein. Each multilayer ceramic substrate contains at least two layers with one being a self-constraining layer.

Methods for making and using self-constrained low temperature glass-ceramic unfired tape for microelectronics

A pressure transducer suitable for use as a component of a passive occupant detection system installed in a passenger vehicle. The transducer comprises first and second contact members separated by a spacing member. The first contact member has on a surface thereof a primary contact comprising first and second terminations and portions spaced apart in a first direction. The second contact member has on a surface thereof a plurality of secondary contacts crossing and facing the spaced-apart portions of the primary contact through an opening in the spacing member. Application of an increasing force causes the contact members to move toward each other, causing an increasing number of the spaced-apart portions to be shorted out by the secondary contacts and causing an increasing number of secondary contacts to contact the primary contact, thereby altering the electrical path between the terminations of the primary contact.

Pressure transducer

Self-constrained low temperature glass-ceramic unfired tape for microelectronics and methods for making and using the same

A multi-layer conductor system including: a base layer having an electrically insulative top portion including alumina; an electrically conductive intermediate layer formed on the top portion of the base layer; and an electrically conductive top layer formed on the intermediate layer; wherein the intermediate layer includes alumina and a precious metal alloy consisting of silver and a precious metal other than silver; wherein the top layer comprises a precious metal selected from the group consisting of silver and a silver alloy such that the difference between the percentage weight of silver in the precious metal of the top layer and the percentage weight of silver in the precious metal alloy of the intermediate layer is limited to thereby provide advantages in use.

Multi-layer conductor system with intermediate buffer layer for improved adhesion to dielectrics

A thick-film paste for printing thick-film circuit elements, including solder stops, conductors, resistors and capacitors, and a method for using the paste. The paste has a composition that includes an organic vehicle, a filler material that contributes the desired electrical and/or material properties to the thick film fired from the paste, and an additive that is insoluble in the organic vehicle and contributes pseudoplastic Theological properties to the paste during printing. The additive also preferably evaporates, burns off, sublimates or is otherwise removed below the firing temperature of the paste.

Thick-film paste with insoluble additive

A hybrid circuit structure that includes a metal substrate, an inorganic electrical insulator layer and at least one inorganic thick-film passive circuit element, such as a thick-film resistor, capacitor or conductor. An interface layer is provided between the insulator layer and the circuit element to prevent the detrimental effects of interlayer diffusion. The composition of the interface layer is selected to prevent the diffusion of constituents from the inorganic insulator layer, and to have a CTE near that of the circuit element to reduce thermal fatigue. As a result, the passive circuit element can be formed of essentially any one of a number of conventional inorganic thick-film materials that are widely used on alumina substrates.

Method of forming thick-film hybrid circuit on a metal circuit board

An improved method of manufacturing thick film circuit wherein an IC is attached to a central conductor pad with adhesive, and wherein spreading of the adhesive is constrained by a ring of porous dielectric material formed between the central conductor pad and the peripheral conductor pads to which the IC terminals are bonded. When the adhesive material is printed and begins to spread, it contacts the porous dielectric ring, which absorbs the adhesive material and stops the spreading. In this way, the porous dielectric ring controls the dimensions of the cured adhesive, thereby preventing the adhesive from contaminating the peripheral conductor pads. Even with the addition of the intervening dielectric ring, the length of the wire-bond connections and the overall dimension of the IC and its conductor pads are both significantly decreased, contributing to improved circuit area utilization and wire-bond durability.

Method of manufacturing a thick film circuit with constrained adhesive

16 A thick-film circuit (10) includes an electrically conductive substrate (12), such as stainless steel, and a first layer of a gold-rich conductor (15) applied directly thereon. The gold layer is fired in a non-oxidizing atmosphere, such as nitrogen, to ensure a solid mechanical and electrical connection between the gold and the substrate. A next layer of a silver composition (20) containing a first proportion of silver to a conductive metal is directly applied to the gold layer (15). Preferably, the composition (20) includes palladium in equal parts with the silver to achieve a secure mechanical and electrical contact with the gold layer with a minimum resistivity. A silver-rich layer (23) is then applied directly onto the intermediate layer. This silver-rich layer (23) is a composition of silver and the conductive metal in a second proportion greater than the first proportion. In one embodiment, this second proportion is three parts silver to one part palladium by weight. The thick-film stack-up (10) provides a minimum resistance conductive path between electrical components mounted on the silver-rich layer (23) and the conductive substrate (12).

Thick-film circuits and metallization process

An improved method of making a multiple print thick film circuit wherein the alignment between successive conductor print steps is both optically inspectable and electrically testable. The first of two or more successive conductor print layers includes a pair of adjacent alignment features with a non-conductive gap therebetween, and the successive conductor print layer includes a pair of identical alignment features which are printed directly on top of the alignment feature pair of the first print layer. When the successive print layer is properly aligned with the first print layer, the non-conductive gap between the alignment features of the first print layer will be preserved, and test probes brought into contact with the features or associated probe pads will reveal a high or open-circuit impedance therebetween. If the successive print layer is mis-aligned relative to the first print layer, one or more of its alignment feature segments or surfaces will bridge the non-conductive gap between the alignment features of the first print layer, and test probes brought into contact with the features or associated probe pads will reveal a low or short-circuit impedance therebetween. Additionally or alternatively, the gap between adjacent alignment features may be optically inspected.

Print alignment method for multiple print thick film circuits

An improved method of manufacturing thick film circuits that effectively eliminates the trade-off between thickness and definition, permitting dielectric layers of increased thickness with no pin-holes, and at the same time, more precise definition of dielectric features, such as via openings and solder stops. The method utilizes a dielectric material that can be co-fired with an underlying conductor, and preferably, that remains porous after firing. A layer of the dielectric material (FDL) is printed atop a dried but not yet fired conductor of the first circuit layer, and then co-fired with the conductor. Spreading of the FDL prior to firing is minimized due to the porosity of the dried but unfired conductor, which absorbs solvent from the FDL. The FDL can be printed in a ring, enclosing a portion of the underlying conductor to form a via definition ring, or VDR. After the FDL and conductor have been co-fired, a relatively thick cover layer of conventional dielectric material is printed over the first circuit layer, partially over-lapping the fired VDR. Again, spreading of the cover layer of dielectric is minimized, this time due to the porosity of the fired VDR, which absorbs solvent from the cover layer dielectric. The cover layer dielectric is then fired, and a second cover layer of conventional dielectric is printed atop the first cover layer to achieve the desired overall dielectric thickness. Spreading of the second cover layer is also inhibited by the fired VDR, resulting in a via with greatly improved definition compared to previously known processes. Alternatively, the FDL can be printed atop a dried but un-fired conductor and then co-fired with the conductor to form a solder stop with significantly improved feature definition. As with the via, the improved definition occurs because the porous un-fired conductor inhibits spreading of the FDL.

Method of manufacturing a thick film circuit with improved dielectric

An improved method of manufacturing multi-layer thick film circuits that effectively eliminates the trade-off between thickness and definition, permitting dielectric layers of increased thickness with no pin-holes, and at the same time, more precise definition of dielectric features, such as via openings and solder stops. The dielectric features are precisely defined by an initial thin layer of dielectric material, referred to as a feature definition print, or FDP. After the FDP has been dried but not yet fired, a via can be formed by printing a comparatively thick cover layer of dielectric, over-lapping the edges of the FDP. Due to the porous nature of the dried but not fired FDP, it absorbs solvent from the dielectric cover layer, which inhibits the spreading of the dielectric cover layer. The FDP is then co-fired with the first dielectric layer, and a second dielectric layer may be provided atop the fired first layer to further increase the overall dielectric thickness, if so desired. This results in a thicker dielectric layer for the same number of successive printing steps, and at the same time, smaller dielectric features. The thicker dielectric layer provides improved isolation between circuit layers, and the smaller dielectric features increase the available surface area for conductors and components on the upper dielectric layer. Additionally, process robustness is improved, since there is less fine tuning and batch-to-batch variation when used in high volume production.

Method of manufacture for a thick film multi-layer circuit

A screen printing device for screen printing a thick film ink through a screen so as to form a highly-defined thick film on a surface of a microelectronics circuit. The screen printing device achieves the above by bypassing excess ink that would otherwise accumulate ahead of the squeegee device, thereby limiting the pressure lead length ahead of the device during the screen printing process. As such, the screen is able to form an adequate seal with the surface of the substrate to prevent ink from bleeding out under the screen, i.e., between the screen and substrate. The result is a well-defined thick film on the substrate, and avoids the necessity of stopping the printing operation in order to remove ink from the lower surface of the screen. The screen printing device enables a method by which well-defined films can be readily deposited at high throughput levels, without necessitating additional procedures, equipment and techniques that might otherwise further complicate the printing process.

Squeegee device for screen printing processes

An ink composition is provided for forming an ultra-thick thick film which is suitable for conducting heat laterally from a heat generating device supported on a substrate. The ink composition is formulated to enable the ultra-thick thick film to be formed as a single layer, such that only a single print, dry and fire cycle is required to form the film. Advantageously, ultra-thick thick films having thicknesses of about 125 micrometers (about 0.005 inch) and greater can be formed by a single layer of the ink composition.

Ink composition for an ultra-thick thick film for thermal management of

An inductive sensing element for sensing displacement of a resilient flexible beam or diaphragm. The inductive sensing element comprises an open faced member and a closed faced member one of which is attachable to the flexible beam and the other of which is attachable to a stationary member. The parameters of both the open and closed faced members are selected so that the self-inductance of the open faced member is determined by the overall distance separating the members. Both the open and closed faced members have a magnetic coating and the open face member further comprises an electrically conductive coating arranged in a predetermined pattern on its magnetic coating. The self- inductance of the open faced member, in particular, the predetermined pattern, is dependent upon the magnetic coating on the open faced member and the magnetic contribution that the magnetic coating of the closed faced member makes to the magnetic coating of the open faced member which, in turn, is dependent upon the overall distance separating the open and closed faced members.

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Noblesville, IN, United States of America

Frans Peter Lautzenhiser