Texas Instruments Corporation

Franklin Santos Marcelino

You Chye How

Huay Yann Tay

Multi-die integrated circuit packages and methods of manufacturing the same are disclosed. An example integrated circuit package includes a first leadframe, a first die on a first side of the first leadframe, and a second die on a second side of the first leadframe opposite the first side. The example integrated circuit package further includes external second leadframe separate from the first leadframe.

Growing community of inventors

Melaka, Malaysia

Franklin Santos Marcelino