International Business Machines Corporation

Franklin M Baez

Jason Lee Frankel

Jean Audet

Paul Robert Walling

Daniel Mark Dreps

David William Boerstler

Eskinder Hailu

Andreas H A Arp

Chad Andrew Marquart

Douglas J Malone

Ching Lung Tong

Lily Jielu Zhang

Charles Leon Arvin

Thomas Weiss

Krishna R Tunga

Anson Jay Call

Brian W Quinlan

Charles L Reynolds

Kazuhiko Miki

Marek Andrzej Orlowski

Kevin Grosselfinger

Roxan Lemire

Deana Cosmadelis

Alain Ayotte

Gilles Poitras

A two-chip die module with minimal chip-to-chip clock skew is provided. The two-chip die module includes a common substrate, first and second chips operably disposed on the common substrate to be communicative in parallel with one another and a single phase lock loop (PLL). The PLL is disposed within one of the first and second chips to provide a source for a common clock signal for the first and second chips. PLL signals of the PLL to the first and second chips are nearly equal and clock sample signals of the first and second chips are nearly equal.

Phase aligning and calibrating clocks from one phase lock loop (PLL) for a two-chip die module

Embodiments of the invention include methods, systems, and computer program products for checking floating metals in a laminate structure. Aspects of the invention include receiving, by a processor, floating metal rules and a semiconductor package design having a plurality of laminate layers. Each laminate layer includes a plurality of metal shapes, a plurality of signal lines, and a plurality of vias. The metal shapes, signal lines, and vias are mapped to one or more cells in an array. The processor determines, for each cell corresponding to a metal shape, whether the plurality of vias satisfies the floating metal rules. The processor can suggest new vias to satisfy the floating metal rules.

Semiconductor package floating metal checks

An IC device carrier includes organic substrate layers and wiring line layers therein. To reduce stain of the organic substrate layers and to provide decoupling capacitance, one or more decoupling capacitor stiffeners (DCS) are applied to the top side metallization (TSM) surface of the IC device carrier. The DCS(s) reduce the amount of curvature of the IC device carrier and reduce the strain seen by the organic substrate layers, thereby mitigating the risk for cracks forming and expanding or other damage within the carrier. The DCS(s) also include two or more capacitor plates and provides capacitance to electrically decouple electrical subsystems of the system of which the DCS is apart.

Decoupling capacitor stiffener

A method of performing automated surface-mount package design includes obtaining physical inputs that include names and locations of top and bottom pins, and obtaining electrical inputs that include electrical parameters such as impedance. The method also includes automatically performing analysis and processing of the physical inputs and the electrical inputs. A design file for manufacture of the surface-mount package is automatically generated based on the performing the analysis and the processing. The design file specifies a number and material of layers of the surface-mount package.

Automated generation of surface-mount package design

The present invention provides for compensation of leakage charge in a PLL. A first plurality and second plurality of charge pumps has a source charge pump and a sink charge pump, and each charge pump has its own switch. A first node is coupled between at least one source charge pump and at least one sink charge pump. A second node coupled between at least one source charge pump and at least one sink charge pump. A PLL filter is coupled to the first node. A dummy filter is coupled to the second node. A first input of a differential mode sensor is coupled to the PLL filter. A second input of a differential mode sensor is coupled to the dummy filter. A first input of a common mode sensor is coupled to the dummy filter. A second input of a common mode sensor coupled to the PLL filter.

Variation tolerant charge leakage correction circuit for phase locked loops

An apparatus, a method, and a computer program are provided for correcting charge in a Phased Lock Loop (PLL). Typically, PLL's utilize a Low Pass Filter (LPF). However, as a result of improvement of Complimentary Metal-Oxide on a Semiconductor (CMOS) technology charge leakage has become prevalent within LPFs. As a result, the method, apparatus, and computer program provide a device and/or methodology for correcting for charge leakage.

Charge leakage correction circuit for applications in PLLs

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Fishkill, NY, United States of America

Franklin M Baez