Kyocera America, Inc.

Kyocera International, Inc.

Franklin Kim

Mark Eblen

Shinichi Hira

Hiroshi Makino

Chong Il-Park

Nobuo Takeshita

Eiji Watanabe

A ceramic feedthrough assembly has a feedthrough interface sleeve brazed to a ceramic feedthrough body and a housing interface sleeve brazed to the feedthrough interface sleeve. The housing interface sleeve is configured to be integrated within an electronic device and welded to a metal housing to form a hermetically sealed electronic device. The ceramic feedthrough has at least one embedded electrical conductor extending from a first location on the ceramic feedthrough body to a second location on the ceramic feedthrough body. The feedthrough interface sleeve is positioned around the ceramic feedthrough body between the first location and the second location and brazed to the wrap-around metallization. When the metal housing is welded to the housing interface sleeve, the ceramic feedthrough assembly facilitates connection to an electronic circuit hermetically sealed in the electronic device with the metal housing.

Ceramic feedthrough assemblies for electronic devices with metal housings

Package deflection and mechanical stress of microelectronic packaging is minimized in a two step manufacturing process. In a first step, a ceramic insulator is high-temperature bonded between a wraparound lead layer and a buffer layer of a same material as the lead layer to provide a symmetrically balanced three-layer structure. In a second step, the three-layer structure is high temperature bonded, using a lower melt point braze, to a heat spreader. This package configuration minimizes package deflection, and thereby improves thermal dissipation and reliability of the package.

Lead package and method for minimizing deflection in microelectronic packaging

An electronics packaging system includes an insulator that electrically insulates a heat sink from electrical leads. An interface between the insulator and the heat sink includes a stress reliever constructed such that a stiffness of the interface is greater than the stiffness of the interface without the stress reliever.

Heat management in electronics packaging

Feedthrough apparatus has a metal housing with an opening therein and a base having a surface at the opening. A ceramic feedthrough extends through the opening in the housing and forms an interface therewith, and is brazed to the housing at the interface. The surface of the base extends at least to the feedthrough and has a cut-out area or opening therein adjacent the feedthrough in order to minimize the surface area contact at the interface between the ceramic feedthrough and the metal housing. The opening in the base may have edges which extend from sidewalls of the feedthrough under the feedthrough by small distances, in order to form a small ledge beneath the outer periphery of the feedthrough. Alternatively, the opening in the base may be approximately equal in size to the feedthrough so as to have edges which engage sidewalls of the feedthrough. The design of the feedthrough apparatus with its minimum of surface interface between the ceramic feedthrough and the metal housing provides for relaxed tolerances therebetween and permits brazing of the feedthrough at the opening within the housing using a high temperature brazing compound.

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San Diego, CA, United States of America

Franklin Kim