Koninklijke Philips Corporation N.v.

Analog Devices,inc.

Lumileds LLC

Lumileds Holding B.v.

Philips Lumileds Lighting Company LLC

Koninklijke Philips Electronics N.v.

Franklin Joseph Wall

Paul Scott Martin

John Edward Epler

Michael David Camras

Oleg Borisovich Shchekin

Frank Michael Steranka

Robert Andrew Zona

Kathleen Anne Hartnett

Jeffrey Dellert Kmetec

Boris Kobrin

Mina Farr

Ling Zhou

William David Collins, Iii

Walter Daschner

Alexander H Nickel

Kuochou Tai

Timothy E Beerling

Behrang Behin

Wen Yu

Gregory W Eng

Meng-Hsiung Kiang

Matthijs Hendrik Keuper

Michael J Daneman

Chuang-Chia Lin

Scott D Dalton

William R Imler

Murali Chaparala

Stefan Eberle

Li Zhang

Mohiuddin Mala

Stephen Panyko

Mark W Chang

Robert Zona

Jonathan J Wierer

Peter Stormberg

Helena Ticha

Ladislav Tichy

Richard S Kern

Oleg B Shchekin

Light emitting die () comprising a plurality of light emitting elements (310A, 310B), each having a pair of bond pads (NPand NP), wherein at least two diagonally opposite bond pads of adjacent light emitting elements on a die have their facing corners truncated () to enable a direct diagonal coupling of a complementary pair of diagonally opposite bond pads when the die is monted on a substrate on which an interconnection pattern is formed. By enabling diagonal as well as lateral coupling of the bond pads of multiple light emitting elements of a die, the multiple light emitting elements may be arranged in a variety of series and/or parallel configurations, thereby facilitating the use of the same die at different nominal operating voltages with a single interconnect layer on the substrate upon which the die is mounted.

Die bond pad design to enable different electrical configurations

A lighting device including a body (). The body () includes a mounting area () with a plurality of conductive pads () and an elongate member () extending from the mounting area (). The mounting area () and the elongate member () are formed of a thermally conductive, electrically insulating material. The conductive pads () are embedded in the thermally conductive, electrically insulating material. The device further includes a semiconductor light emitting device () disposed in direct contact with the body () in the mounting area ().

Lighting device including a thermally conductive body and a semiconductor light emitting device

LED clamp

An optical cross-connect switch comprises a base (), a flap () and one or more electrically conductive landing pads () connected to the flap (). The flap () has a bottom portion that is movably coupled to the base () such that the flap () is movable with respect to a plane of the base () from a first orientation to a second orientation. The one or more landing pads () are electrically isolated from the flap () and electrically coupled to be equipotential with a landing surface.

Optical cross-connect system

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Vacaville, CA, United States of America

Franklin Joseph Wall