Hesse & Knipps Gmbh

Hesse Gmbh

Hess & Knipps Gmbh

Frank Walther

Hans-Juergen Hesse

Hans J&uuml;rgen Hesse

Andreas Jochheim

J&ouml;rg Wallaschek

Hans-Jürgen Hesse

A method for bonding large modules with the following steps, a large module is fed to a bonder from behind in a loading plane by means of a feeder unit. The large module is passed from the feeder unit to a first transverse conveyor unit, and is brought by the same to a first buffer position provided in the bonder, wherein the first buffer position is provided in a loading plane of the bonder. The large module is brought from the first buffer position into a first receiving position in the loading plane via the first transverse conveyor unit and is passed there to a vertical conveyor unit.

Method for bonding large modules, and bonding arrangement

A calibration method for a bonder. Characteristics of a force actuator of the bonder are measured and stored in such a way that the force actuator can be controlled optimally during production operation of the bonder on the basis of the measured data. Further, a device for fully automatic or partially automatic bonding force calibration.

Automatic bonding force calibration

The invention relates to a method which is used to carry out adjusting operations on a bond head, wherein a bond head element is positioned in relation to a reference element, especially an ultrasonic tool. According to the invention, at least the surrounding area of the reference element, especially the tip of the ultrasonic tool, is optically detected by means of a camera and is displayed in an image on a display device. A marking is superimposed in the display in order to facilitate positioning. The invention also relates to an ultrasonic bonder comprising a camera which is used to support the positioning of a bond head element. Said camera can optically detect at least the area surrounding the reference element, especially the tip of the ultrasonic tool.

Camera-assisted adjustment of bonding head elements

A method and apparatus for the nondestructive testing of a bond connection between a bond wire and a substrate or pad which utilizes an ultrasonic tool for bonding the bond wire to the substrate or pad. The test force is applied in the plane of the bond connection transversely to the bond wire through an ultrasonic welding tool.

Method of and apparatus for testing a wire bond connection

A wire brake for use with automatic wedge bonding machines which have cutting pliers arranged behind the associated bonding tool and movable along the bonding wire for detaching bonding wire from the open pliers. The wire brake includes guiding members having a plurality of deflectors that can be applied to the bonding wire, the guiding members having two planes from which the bonding wire can be laterally deflected. A central deflector is provided for deflecting the bonding wire from the planes. The central deflector projects between the two planes for guidance of the bonding wire and is displaceable transverse to the longitudinal extension of the bonding wire. Additional guiding members are arranged opposite the planes such that the bonding wire rides between the central deflector and the additional guiding members when the bonding wire is deflected.

Wire brake

A feed unit for moving parts over short distances has a four-bar chain forming a translating solid parallelogram having two parallel rigid opposite legs, one of which constitutes a base leg, connected to one another by elastic elements and a piezoelectric stack translator extending between and flexibly connected to the rigid legs for articulation relative to the rigid legs and oriented at an angle of incidence (&agr;) with respect to a base leg that is less than 90&deg; and greater than 45&deg;.

Growing community of inventors

Brakel, Germany

Frank Walther