Soraa, Inc.

Ecosense Lighting, Inc.

Sorra, Inc.

Frank Tin Chung Shum

Clifford T Jue

Michael Ragan Krames

Artem Mishin

Zinovy Dolgonosov

Abdul Assaad

Aurelien J F David

Frank Michael Steranka

Wilfred Martis

Thomas M Katona

Cliff Jue

Accessories for LED lamp systems and methods of attaching accessories to illumination sources (e.g., LED lamps) are disclosed. A beam shaping accessories mechanically affixed to the LED lamp. The lens is designed to adapt to a first fixture that is mechanically attached to the lens. Accessories are designed to have a second fixture for mating to the first fixture such that the first fixture and the second fixture are configured to produce a retaining force between the first accessory and the lens. The retaining force is a mechanical force that is accomplished by mechanical mating of mechanical fixtures, or the retaining force is a magnetic force and is accomplished by magnetic fixtures configured to have attracting magnetic forces. In some embodiments, the accessory is treated to modulate an emanated light pattern (e.g., a rectangular, or square, or oval, or circular or diffused emanated light pattern). A USB connector is also provided.

Accessories for LED lamp systems

Illumination sources including a light generation portion comprising an LED assembly configured to output light at a first intensity while generating a first quantity of heat per unit time are disclosed. The heat dissipation portion comprises an MR-16 form factor heat sink configured to dissipate at least the first quantity of heat per unit time, wherein the light generation portion and the heat dissipation portion are characterized a first mass, and wherein a ratio of the first intensity to the first mass is within a range of about 10 lumens per gram to about 30 lumens per gram.

Illumination source with reduced weight

Compact reflective lens for a high intensity light emitting diode light sources having improved output beam characteristics are disclosed. The reflective lenses can be configured to increase output intensity, control output light characteristics, and reduce glare.

Glare reduced compact lens for high intensity light source

The present invention relates to a compact optic lens for a high intensity light source having improved output beam characteristics. The compact optic lens provides increased light output without increasing device cost or device size to enable coverage of many beam angles.

Compact lens for high intensity light source

Accessories for LED lamps and methods of attaching accessories to illumination sources (e.g., LED lamps) are disclosed. A beam shaping accessories mechanically affixed to the LED lamp. The lens is designed to adapt to a first fixture that is mechanically attached to the lens. Accessories are designed to have a second fixture for mating to the first fixture such that the first fixture and the second fixture are configured to produce a retaining force between the first accessory and the lens. In some embodiments, the retaining force is a mechanical force that is accomplished by mechanical mating of mechanical fixtures. In other embodiments, the retaining force is a magnetic force and is accomplished by magnetic fixtures configured to have attracting magnetic forces. In some embodiments, the accessory is treated to modulate an emanated light pattern (e.g., a rectangular, or square, or oval, or circular or diffused emanated light pattern).

Accessories for LED lamps

An LED lighting system powered by an AC power source comprising a rectifier module configured to provide a rectified output to a first group of LED devices and a second group of LED devices electrically coupled to the first group of LED devices. A current monitor module electrically coupled to the first group and to the second group of LED devices is configured to determine a first current level using a drawn current level signal associated with the first group of LED devices and a second current level using a reference current level signal associated with the second group of LED devices. The current monitor module is electrically coupled to a temperature sensing module that is configured to generate at least one compensation factor based at least in part on a temperature. The compensation factor is used to control (directly or indirectly) current through the LED devices.

High temperature LED system using an AC power source

An lighting source includes a driver for outputting electrical power in response to external electrical power, wherein the driver generates heat in response thereto, a lamp coupled to the driver, for outputting light in response to the electrical power, wherein the lamp generates heat in response thereto, a first heat sink physically coupled to the driver for receiving and dissipating heat there from, a second heat sink physically coupled to the light for receiving heat and dissipating heat there from, and an insulating portion disposed between the first heat sink and the second heat sink, wherein the insulating portion is configured to inhibit heat from the lamp from being transferred to the driver.

Illumination sources with thermally-isolated electronics

An illumination source includes a heat sink with an inner core region and an outer core region having structures to dissipate heat from the inner core region. An LED assembly is pressed into a thermally-conductive compound disposed between the LED assembly and the inner core region. A retaining clamp is used to mechanically press the LED assembly into the thermally-conductive compound.

Illumination source with direct die placement

A light source comprises a heat-sink having a mounting region, and heat-dissipating fins, a base housing having an inner cavity and coupled to the heat-sink, and an integrated lighting module including: a printed circuit board; an LED on a substrate coupled to the printed circuit board within a first lateral region of the printed circuit board, and an electronic driving circuit for providing power to the LED and coupled to the printed circuit board within a second lateral region of the printed circuit board, wherein a bottom surface of the substrate is thermally coupled to the mounting region of the heat-sink, and wherein the second lateral region of the integrated lighting module is located within the inner cavity of the base housing.

High intensity light source

System and method for LED packaging. The present invention is directed to optical devices. More specifically, embodiments of the presentation provide LED packaging having one or more reflector surfaces. In certain embodiments, the present invention provides LED packages that include thermal pad structures for dissipating heat generated by LED devices. In particular, thermal pad structures with large surface areas are used to allow heat to transfer. In certain embodiments, thick thermally conductive material is used to improve overall thermal conductivity of an LED package, thereby allowing heat generated by LED devices to dissipate quickly. Depending on the application, thermal pad structure, thick thermal conductive layer, and reflective surface may be individually adapted in LED packages or used in combinations. There are other embodiments as well.

System and method for LED packaging

A illumination source includes a LED assembly and an MR-16 form factor heat sink coupled to the LED assembly. The MR-16 form factor heat sink has an inner core region and an outer core region with the LED assembly disposed upon the inner core region, and the outer core region providing a heat sink.

Illumination source with reduced inner core size

A light source manufacturing method includes disposing LEDs upon a substrate having input pads for receiving an operating voltage for the LEDs, bonding a flexible PC board to the substrate, and using a thermally conductive adhesive bonding the substrate onto a planar region of a heat sink.

Illumination source and manufacturing methods

Power management and thermal management for high intensity LED lamps are disclosed.

Growing community of inventors

Sunnyvale, CA, United States of America

Frank Tin Chung Shum