Semiconductor Components Industries, LLC

Frank Tim Jones

Stephen St Germain

Roger Arbuthnot

Phillip Celaya

In one embodiment, a semiconductor package includes a first and a second die flag, wherein the first and second die flags are separated by a gap. First and second metal oxide semiconductor field effect transistor (MOSFET) die are on the first and the second die flags, respectively. A power control integrated circuit (IC) is stacked on top of at least one of the first or the second MOSFET die. A mold compound is encapsulating the power control IC, the first and second MOSFET die, and the first and second die flags.

Dual-flag stacked die package

In one embodiment, a semiconductor package is formed to include a leadframe that includes a plurality of die attach areas for attaching a semiconductor die to the leadframe. The leadframe is positioned to overlie another leadframe that forms some of the external terminals or leads of the package.

Growing community of inventors

Gilbert, AZ, United States of America

Frank Tim Jones