Nepes Led Corporation

University of California

Frank Shi

Nguyen The Tran

Yongzhi He

Ralph V Clayman

Yeong-Her Lin

Yuan-Chang Lin

Michael K Louie

Yungzhi He

An LED leadframe package with surface tension function to enable the production of LED package with convex lens shape by using dispensing method is disclosed. The LED leadframe package of the invention is a PPA supported package house for LED packaging with metal base, four identical metal electrodes, and PPA plastic to fix the metal electrodes and the heat dissipation base together, four ring-alike structures with a sharp edge and with a tilted inner surface, and three ring-alike grooves formed between sharp edge ring-alike structures.

Leadframe package for light emitting diode device

A lamp cover containing phosphor for providing white light emission is disclosed. The lamp cover is comprised of a light-partial-reflective cap structure providing the outer surface of the lamp cover, wherein the light-partial-reflective cap structure is composed of a plurality of light transparent layers and a plurality of vacuum layers that are stacked in an alternating manner from outside to inside, a supporting transparent cap structure providing the inner surface of the lamp cover, and a phosphor mixed structure mechanically supported by the outer surface of the supporting transparent cap structure, wherein the outer surface of the phosphor mixed structure is adjacent to the most inner vacuum layer of the light-partial-reflective cap structure. Once the lamp cover is combined with a phosphor exciting light source, the light-partial-reflective cap structure partially prevents phosphor exciting light from escaping from the lamp cover by using Fresnel reflection.

Lamp cover including a phosphor mixed structure for light emitting device

A silicone composition having anti-microbial properties contains well distributed silica and nanoparticles of a noble metal. Silica and nanoparticles of a noble metal are added to liquid vinyl-terminated polydimethylsiloxane. A coupling agent is then added to the mixture and heated, the coupling agent comprising trialkoxysilane having a formula RSi(OR), wherein Ris vinyl or allyl, and Ris an alkyl radical having from 1 to 3 carbon atoms. In one embodiment, trimethylsiloxy terminated polymethylhydrosiloxane is then added to the mixture and heated in the presence of a catalyst so as to cross-link and cure the same into a silicone elastomer. In another embodiment, in place of the trimethylsiloxy terminated polymethylhydrosiloxane, a peroxide is added to mixture and heated to form the silicone. In this later example, no catalyst is needed.

Silicone composition and devices incorporating same

A white light emitting diode (LED) package with multilayered encapsulation structure and the packaging methods are disclosed. The white LED package structure includes metal electrodes, a heat dissipation base, a PPA plastic for fixing the electrodes and the heat dissipation base together, at least one LED die, a die attaching material, gold wires for electrically connecting the LED die to the electrodes, a first type of silicone encapsulant, a second type of silicone encapsulant, and a phosphor containing layer. The invention utilizes a low-refractive index silicone (the second type of silicone encapsulant) to separate the phosphor containing layer away from the first type of silicone, which covers the LED die, to prevent/reduce emitted light going backward and hitting the LED die.

White light emitting diode package having enhanced white lighting efficiency and method of making the same

An LED lamp cover structure containing luminescent material and its fabrication methods are described. The LED lamp cover is comprised of a first lens cap providing the outer surface of the lamp cover, a second lens cap providing the inner surface of the lamp cover, and an encapsulating layer sandwiched between the lens cap providing the outer surface of the lamp cover and the lens cap providing the inner surface of the lamp cover, which is mixed with luminescent material for wavelength conversion.

Lamp-cover structure containing luminescent material

An LED lamp cover structure containing luminescent material, its fabrication methods, and an LED package using the LED lamp cover are disclosed. The LED lamp cover is comprised of a first lens cap providing the outer surface of the lamp cover, a second lens cap providing the inner surface of the lamp cover, and an encapsulating layer sandwiched between the first and second lens caps. The lamp cover of the invention covering a color LED package such as blue color can provide white light output.

Growing community of inventors

Irvine, CA, United States of America

Frank Shi