Robert Boschgmbh

Seg Automotive Germany Gmbh

Frank Schatz

Detlef Nowak

Joerg Muchow

Gottfried Flik

Timo Schary

Joerg Heyse

Guenter Dantes

Stefan Arndt

Heinz Fuchs

Kerrin Doessel

Beate Ader

Helmut Grutzeck

Gilbert Moersch

Dietmar Hahn

Heinz Eisenschmid

Daniel Monteiro Diniz Reis

Mathias Mews

Stefan Pinter

Andreas Kugler

Juergen Seiz

Daniel Pantel

Gunter Dantes

Bernhard Lucas

Mirko Hattass

Simon Armbruster

Kurt Weiblen

Thorsten Balslink

Rainer Straub

Frederic Njikam Njimonzie

Thomas Beez

Herbert Olbrich

Johannes Baader

Ronald Glas

Jorg Heyse

Jochen Tomaschko

Eberhard Moess

Juergen Graf

Denis Gugel

Armin Glock

Thomas Schittny

Carsten Raudzis

Joachim Dutzi

Manfred Leiter

Frank Fischer

Ando Feyh

Hans Artmann

Reinhard Neul

Ning Qu

Stefan Leidich

Gerhard Lammel

Jochen Franz

Hans Braun

Udo-Martin Gomez

Fabian Henrici

Helmut Baumann

Klaus Heyers

Tino Fuchs

Klaus Walter

Frank Reichenbach

Juergen Hackenberg

Helmut Sautter

Jan Sparbert

Friedjof Heuck

Arne Dannenberg

Andreas Petersen

Achim Breitling

Stefan Weiss

Volker Holzgrefe

Matthias Kuehnel

Mathias Reimann

Wolfgang Welsch

Andreas Lassl

Robert Roelver

Janpeter Wolff

Georg Bischopink

Hendrik Specht

Nils Felix Kuhlmann

Peter Degenfeld-Schonburg

J&ouml;rg Heyse

Nikolaus Simon

Zoltan Lestyan

Kersten Kehr

Niels Bode

Paul Farber

Andreas Arlt

Janine Riedrich-Moeller

Ralf Trutschel

Theresa Lutz

Horst Magenau

Stefan Mark

Fouad Bennini

Christian Patak

Christian Bierhoff

Ralf Boessendoerfer

Franziska Rohlfing

Alexandra Jauernig

Wolfram Schock

Petra Heinbuch

Achim Dieterich

Thomas Kuenstle

A micromechanical device, in particular a micromirror device. The device has at least one first micromechanical component and one second micromechanical component. The first component and the second component are directly or indirectly joined to one another. The first micromechanical component has a first sub-body and at least one second sub-body. The first sub-body extends in a first plane and the second sub-body in a second plane different from the first plane. The first plane and the second plane extend parallel to one another and the first plane extends above the second plane. The second sub-body is arranged in a transitional region to the second micromechanical component. A second extent of the second sub-body in the longitudinal direction is greater than a first extent of the first sub-body in the longitudinal direction.

Micromechanical device

An apparatus and a method for monitoring a semiconductor component are disclosed. A leakage current which flows through a first electrode and a second electrode of the semiconductor component is detected during operation of the semiconductor component. During a comparison, the leakage current is compared with a first limit value for the leakage current and an output is determined on the basis of a result of the comparison and/or a time is determined at which an extreme point, in particular a maximum, of the leakage current occurs and an output is determined on the basis of the time. The output comprises a state of the semiconductor component, and the output is output.

Apparatus and method for monitoring a semiconductor component

A semiconductor component that includes at least one dielectric layer and at least one first electrode and one second electrode. A first defect type and a second defect type, which is different from the first defect type, are also present in dielectric layer. The at least two different defect types accumulate at one of the two electrodes as a function of a main operating voltage applied between the first electrode and the second electrode, and of a main operating temperature that is present at characteristic times τand τ, and generate the maximum changes in barrier height δΦand δΦat the electrodes. τand δΦare associated with the first defect type, and τand δΦare associated with the second defect type. τ<τand δΦ<δΦapply.

Semiconductor component including a dielectric layer

A semiconductor component that includes at least one dielectric layer and at least one first electrode and one second electrode. In addition, at least two defect types different from one another are present in the dielectric layer. These at least two defect types different from one another move along localized defect states, each at an average effective distance, in the direction of one of the two electrodes as a function of an operating voltage that is applied between the first electrode and the second electrode, and an operating temperature that is present. The average effective distance is greater than 3.2 nm.

Device and method for using a semiconductor component in which a dielectric layer is situated between a first electrode and a second electrode of the semiconductor component, defects of a first defect type being present in the dielectric layer. The method includes: operating the semiconductor component using a first voltage having a first polarity between the first electrode and the second electrode, determining whether or not a condition is met for switching over from operating the semiconductor component using the first voltage to operating the semiconductor component using a second voltage, which has a second polarity opposite the first polarity, continuing the operation of the semiconductor component using the first voltage if the condition is not met, and otherwise ending the operation of the semiconductor component using the first voltage, and operating the semiconductor component using the second voltage between the first electrode and the second electrode.

Method and device for using a semiconductor component

A method for activating a drive unit of a deflection unit of a two-dimensional microscanner device. First and second control signals for activating the drive unit of the deflection unit are initially generated using a processing unit. The first and second control signals are subsequently transferred to the drive unit. A sinusoidal first movement of the deflection unit about a first axis and a sinusoidal second movement of the deflection unit about a second axis are carried out at a first point in time based on the transferred control signals. The first control signals are then adapted so that a periodic third movement is superimposed on the first movement at a second point in time following the first point in time. Alternatively, the second control signals are adapted so that a periodic fourth movement is superimposed on the second movement at the second point in time following the first.

Method and processing unit for activating at least one drive unit of at least one deflection unit of a microscanner device

A micromechanical component. The micromechanical component includes: a mount; a displaceable part; and a first serpentine spring and a second serpentine spring which is embodied mirror-symmetrically with respect to the first serpentine spring in terms of a first plane of symmetry; a first actuator device and a second actuator device being embodied in such a way that by way of the first actuator device and the second actuator device, periodic deformations, mirror-symmetrical in terms of the first plane of symmetry, of the first serpentine spring and of the second serpentine spring are excitable; the micromechanical component also encompassing a first torsion spring and a second torsion spring that each extend along a rotation axis; and the displaceable part being displaceable, at least by way of the periodic and mirror-symmetrical deformations of the first serpentine spring and of the second serpentine spring, around the rotation axis with respect to the mount.

Micromechanical component and method for producing a micromechanical component

A MEMS device and a corresponding operating method. The MEMS device is equipped with an oscillatory micromechanical system, which is excitable in a plurality of useful modes, the oscillatory micromechanical system including at least one system component, which is excitable in at least one parasitic spurious mode by a superposition of the useful modes. An adjusting device is provided, which is configured in such a way that it counteracts the parasitic spurious mode by application of an electromagnetic interaction to the system component.

MEMS device including spurious mode suppression and corresponding operating method

A micromirror device, including a substrate and an outer frame element, which is connected to the substrate along a first oscillating axis with the aid of a first suspension device, and is deflectable about the first oscillating axis. In addition, the micromirror device includes an inner frame element, which is connected to the outer frame element along the first oscillating axis with the aid of a second suspension device; as well as an oscillating plate, which includes a micromirror and is connected to the inner frame element along a second oscillating axis, with the aid of a third suspension device; the first oscillating axis being perpendicular to the second oscillating axis. The inner frame element includes displaceable deflection elements, the oscillating plate being deflectable by displacing the deflection elements relative to the outer frame element.

Micromirror device and method for operating a micromirror device

A magnetic actuator includes: a plate having a main plane of extent and mounted rotatably about at least one first axis of rotation which is parallel to the main plane of extent, the plate having at least one conductor loop parallel to the main plane of extent; a magnetic bracket situated beneath the plate and having a U-shaped magnetic flux conducting rail and a hard magnet whose magnetization is perpendicular to the U-shaped opening, the magnetic bracket and the plate being aligned with one another in such a way that the opening in the magnetic bracket points toward the main plane of extent of the plate, the U-shaped magnetic flux conducting rail having a main direction of extent parallel to the first axis of rotation, and the plate being deflectable about the at least one axis of rotation by energizing the at least one conductor loop.

Magnetic actuator

A micromechanical constituent includes an actuator designed to impart to a displaceable element a first displacement motion around a first rotation axis and a second displacement motion around a second rotation axis oriented tiltedly with respect to the first rotation axis, the actuator including a permanent magnet on a first spring element and a one second permanent magnet on a second spring element, where the first permanent magnet is excitable to perform a first translational motion tiltedly with respect to the first rotation axis and tiltedly with respect to the second rotation axis, and the second permanent magnet is excitable to perform a second translational motion directed oppositely to the first translational motion, causing the second displacement motion of the displaceable element around the second rotation axis.

Micromechanical constituent and method for adjusting an adjustable element

The disclosure relates to a method for measuring a current using a diamond material. The diamond material has at least one nitrogen deposit and an imperfection in a crystal lattice of the diamond material, adjacent to the nitrogen deposit. The method comprises a providing step, a detecting step and an evaluating step. In the providing step, electromagnetic waves are provided to excite the diamond material. In the evaluating step, an intensity of a fluorescence of the diamond material is detected. In the evaluating step, the intensity and a frequency of the electromagnetic waves are evaluated in order to determine a magnetic field strength influencing the fluorescence.

Method for measuring an electrical current and current sensor

A micromechanical component includes an adjustable part, a mounting, at least one bending actuator, and a permanent magnet. The part is positioned on the mounting so as to be adjustable relative to the mounting about a first rotation axis and about a second rotation axis inclined relative to the first axis. The actuator includes at least one movable subregion. Movement of the subregion results in a restoring force that moves the part about the first axis. The part is connected indirectly to the magnet to be adjustable about the second axis of rotation via a magnetic field built up by the magnet together with a yoke device of the component or an external yoke. A micromirror device includes the micromechanical component. A method for adjusting the part includes adjusting the part simultaneously about the first and the second axes.

Micromechanical component and method for adjusting an adjustable part simultaneously about two axes of rotation inclined in relation to one another

A micromirror scanner and a method for controlling a micromirror scanner. The method includes furnishing a shot pattern which has at least information regarding first control application signals as a function of mirror positions of a displaceable micromechanical mirror of the micromirror scanner, which are designated to control a light source of the scanner; determining a mirror position of the mirror; emitting light beams into a solid angle; measuring light beams reflected at an object in the solid angle to determine a distance between the object and the scanner; determining a nature or position of the object with respect to the scanner as a function of the determined distance and the determined current mirror position; and adapting the shot pattern as a function of the position and/or nature of the object.

Method for controlling a micro-mirror scanner, and micro-mirror scanner

An assembly body for micromirror chips that partly encloses an internal cavity, the assembly body including at two sides oriented away from one another, at least one respective partial outer wall that is fashioned transparent for a specified spectrum, and the assembly body having at least one first outer opening on which a first micromirror chip can be attached, and a second outer opening on which a second micromirror chip can be attached, in such a way that a light beam passing through the first partial outer wall is capable of being deflected by the first micromirror chip onto the second micromirror chip, and is capable of being deflected by the second micromirror chip through the second partial outer wall. A mirror device and a production method for a mirror device are also described.

Assembly body for micromirror chips, mirror device and production method for a mirror device

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Kornwestheim, Germany

Frank Schatz