Credence Systems Corporation

Nptest, Inc.

Presto Engineering, Inc.

Frank Sauk

Gary A Wells

Daniel Calvert Canfield

William Joseph Yost, Iii

Thomas P Ho

John Joseph Harsany

A heat spreader comprising a sheet of transparent diamond with an aperture therein that accommodates a solid-immersion lens (SIL). The heat spreader may be mounted within a clamp which allows the heat spreader to move freely across the Device Under Test (DUT) while maintaining a very high degree of planarity and contact between the diamond and the silicon substrate of the DUT. The DUT is secured to its electrical interface with a low profile clamp, the DUT may be held within the clamp by a mechanism that applies a pressure to the sides of the DUT package.

Apparatus for thermal control in the analysis of electronic devices

A package optimized for thinning of an attached semiconductor die. The package comprises an extension ring attached to a bottom surface of the package, and a die carrier plate attached to the extension ring for receiving a semiconductor die. The die carrier plate may be attached to the extension ring by an adhesive that permits removal of the carrier plate from the semiconductor die and extension ring by a small applied force after encapsulation of the semiconductor die. The encapsulant may include a filler material for modifying properties such as hardness, thermal coefficient of expansion, thermal conductivity. The materials used for the extension ring and encapsulant may be selected for compatibility with the die lapping operation.

System and method for packaging a semiconductor device

A test system for testing an electronic device is deployable in two basic configurations. In one of the configurations, a load board ( ) that receives a unit ( ) of the device is directly attached to a test head ( ). In the other configuration, the same load board or one having largely the same pattern of test-head signal transmission positions is coupled through an interface apparatus ( ) to a test head. A probe system ( ) contacts that load board or/and the interface apparatus. The interface apparatus is normally configured to largely prevent test-head vibrations from being transferred to the probe system. Additionally or alternatively, the load board is vacuum attached to the interface apparatus.

Test system and methodology

Growing community of inventors

San Ramon, CA, United States of America

Frank Sauk