Infineon Technologies Ag

Frank Sauerland

Reinhold Bayerer

A semiconductor arrangement includes a controllable semiconductor element having an active region, and bonding wires arranged in parallel to each other in a first horizontal direction. The active region has a first length in the first horizontal direction and a first width in a second horizontal direction perpendicular to the first horizontal direction. Each bonding wire is electrically and mechanically coupled to the controllable semiconductor element by a first number of bond connections arranged above the active region. A first bond connection of each bonding wire is arranged at a first distance from a first edge of the active region. A second bond connection of each bonding wire is arranged at a second distance from a second edge of the active region opposite the first edge. The first and second distances are both less than the first length divided by twice the first number of bond connections.

Semiconductor arrangement and method for producing the same

A power semiconductor module arrangement includes a semiconductor substrate having first and second metallization layers attached to a dielectric insulation layer, the dielectric insulation layer being disposed between the metallization layers. A layer of heat-conducting material is arranged between the semiconductor substrate and a base plate in a vertical direction of the power semiconductor module arrangement. The layer of heat-conducting material is arranged adjacent to a plane surface of the semiconductor substrate and adjacent to a plane surface of the base plate. The semiconductor substrate has a first thermal expansion coefficient of 8 ppm/K or lower, the base plate has a second thermal expansion coefficient of 9 ppm/K or lower, and the layer of heat-conducting material has a third thermal expansion coefficient of 18 ppm/K or higher. The layer of heat-conducting material has a thickness in the vertical direction of between 40 &#x3bc;m and 150 &#x3bc;m.

Growing community of inventors

Werne, Germany

Frank Sauerland