Jenoptik Aktiengesellschaft

Jenoptik Technologie Gmbh

Frank Reuther

Lutz Mueller

Alf Springer

Bernd Seher

Hans Biedermann

Rudi Neuland

Matthias Heckele

A device and a method for transferring microstructures from a tool to a substrate which is to be structured. The device and method are intended to align the tool and the substrate in a mutually controlled manner. The device contains supports for the tool and the substrate which can be displaced in an opposing direction in relation to one another, resulting in an alteration of the distance between the tool and the substrate. A measuring system is provided which can be inserted between the supports, for measuring selected locations on at least one measuring plane. The direction of displacement of the supports is aligned vertically in relation to said measuring plane. The measuring system forms a fixed spatial relationship with the tool in a measuring position. The substrate can be aligned in relation to the tool. The method and device can be used for producing microstructured components.

Device and method for transferring microstructures

The object, in a device and a method for separating a shaped substrate from a stamping tool, is to make demolding more functionally reliable and to substantially prevent damage to expensive components. A closeable chamber, the mutually moveable chamber parts of which are the support for the stamping tool and for the shapeable substrate, contains a substrate holder which, when the chamber is closed, fixes. the substrate to its support outside the stamping area, with the result that the substrate is detached from the stamping tool when the chamber is opened. The device and method can be used for the production of microengineered components.

Device and method for separating a shaped substrate from a stamping tool

The apparatus and process to compensate for variations in thickness of molding tools and of moldable materials used in an embossing process to be carried out under a vacuum, while ensuring high dimensional stability, and to ensure different molding depths. For achieving this object, a chamber is employed having a pair of oppositely lying chamber parts, of which one is fixed to the framework and the other is adjustable, having side walls which comprise an inner part and an outer part. The inner part is fastened to the fixed chamber part and the outer part, on the outwardly facing end face to of which the adjustable chamber part comes to bear against the force of a spring during the closing of the chamber, is displaceable along guide elements on the fixed chamber part between two stops. Within the chamber there takes place a setting of atmospheric conditions and of temperature conditions at points in time of the closing of the chamber at which an increase in a force acting on the fixed chamber part reaches predetermined values. Apparatus and processes employing such chamber are used in the production of microsystem components

Apparatus for molding microsystem structures

A device for manipulating a synchrotron beam bundle is intended to produce properties of the beam bundle, under vacuum conditions, which are adapted to the respective application of deep X-ray lithography, in particular, which are adapted to the scanning regimen. Pairs of diaphragms which are displaceable relative to one another are provided between the object table and an inlet window within a vacuum chamber containing an object table for receiving an object to be irradiated, which object table is adjustable by a scanning movement relative to the synchrotron beam bundle. The pair of diaphragms for which the direction of relative displacement of the diaphragms coincides with the scanning movement is coupled with the scanning movement. Further, a filter chamber is arranged upstream of the vacuum chamber and contains filters which can be inserted into the synchrotron beam bundle. The device is for use in irradiating equipment for deep X-ray lithography which are used to fabricate microsystems components by means of a technique known as the LIGA process (lithography with synchrotron radiation, electroforming and plastics molding).

Device for manipulating a synchrotron beam bundle

In an irradiation device for deep x-ray lithography the adjustment precision necessary for the irradiation is to be ensured and influences, which act uncontrolled on the adjusted position, substantially eliminated. An object stand is provided which is surrounded by a vacuum chamber, secured to a carrier and is movable with positioning means with respect to a beam and which has a holder suitable not only to receive an article to be irradiated but also to receive an adjusting element. Between the carrier, object stand and positioning means on the one hand and the vacuum chamber on the other hand there is a first isolating, flexible connection and between wall elements, of which one is connected to the carrier and the other is fixed to the frame, there is a second isolating, flexible connection, the surfaces of the two isolating, flexible connections acting against the external air pressure being of the same size. The vacuum chamber and a space defined by the wall elements with the second flexible connection are coupled together for pressure balancing. Such irradiation devices are usable for manufacturing technical microsystem components in accordance with a technology which has become known under the name LIEA process (Lithography with Synchrotron Radiation, Galvano shaping Forming Technology with Plastics).

Growing community of inventors

Rudolstadt, Germany

Frank Reuther