Infineon Technologies Ag

Circle Smart Card Ag

Bundesdruckerei Gmbh

Genua Gmbh

Frank Püschner

Manfred Paeschke

Peter Stampka

Teck Sim Lee

Detlef Houdeau

Jörg Fischer

Erik Heinemann

Wolfgang Schindler

Olaf Dressel

Boon Huat Lim

Franz Gabler

Ewald Simmerlein-Erlbacher

Bernhard Schätzler

Andreas Müller-Hipper

Bernd Ebersberger

Jürgen Fischer

Reinhard Proske

Pei Pei Kong

Matthias Ochs

A wafer-level package sensor device including a capacitive sensor, a controller which is electrically conductively connected to the sensor, wherein the capacitive sensor is formed by partially overlapping redistribution layer tracks of the wafer-level package sensor device formed in different planes, and multiple contact surfaces connected to the controller, which are configured to electrically couple to a chip card module carrier using a flip-chip connection.

Wafer-level package sensor device

A lead frame strip includes a plurality of connected unit lead frames, each unit lead frame having a die paddle and a plurality of leads connected to a periphery of the unit lead frame. A semiconductor die is attached to the die paddles. A molding compound covers the unit lead frames, including the semiconductor dies. Prior to testing or other processing of the lead frame strip, a gap is etched into a region of the leads which are shared by adjacent ones of the unit lead frames. The gap extends at least mostly through the shared leads. A partial cut is made in the molding compound around the periphery of the unit lead frames prior to the subsequent processing, including below the gap in the shared leads, to electrically isolate the leads of the unit lead frames.

Method of electrically isolating shared leads of a lead frame strip

A chip card with a chip module having an integrated circuit and, for external contacting, has on a main face a contact zone with a number of contact areas which are spaced apart from one another and are electrically connected to the integrated circuit. At least one contact area is made up of first functional regions with first surfaces and of second functional regions with second surfaces, and the first surfaces of the first functional regions lie higher with respect to the main face than the second surfaces of the second functional regions.

Chipcard with contact areas and method for producing contact areas

A contactless chip card and a method for producing a contactless chip card in which a plastic carrier having clearances is provided, on which an antenna coil is arranged on an upper side of the plastic carrier and a device having an integrated circuit is arranged on a rear side of the plastic carrier that is opposite from the upper side, an electrical connection is produced between the coil and the device, the plastic carrier is introduced into an injection mold and a card body is molded onto the rear side of the plastic carrier by the injection-molding process.

Chip card

A smart card is laminated from at least two layers of paper or film as a mounting material. A first of the layers is fitted with a semiconductor chip and a second layer has connecting contacts as well as conductor tracks or external connecting surfaces. The contacts of the semiconductor chips are electrically conductively connected to the connecting contacts on the second layer. No chip modules are required to produce the smart cards. The mounting materials provided with ICs and contacts can be laminated in an endless roll format, in the same way as for paper production.

Method for producing laminated smart cards

A smart-card module is described which has a substrate film of an anisotropically conductive material and at least one semiconductor chip. The semiconductor chip has connection points. On one surface of the semiconductor film, contact areas are applied directly. The substrate film is disposed between the semiconductor chip and the contact areas in such a way that it connects the connection points of the semiconductor chip to the contact areas in a manner of a direct contact.

Smart-card module with an anisotropically conductive substrate film

Growing community of inventors

Kelheim, Germany

Frank Püschner