Infineon Technologies Ag

Siemens Aktiengesellschaft

Infineon Technologies Austria Ag

Bundesdruckerei Gmbh

Frank Pueschner

Peter Stampka

Jens G Pohl

Thomas Spoettl

Juergen Hoegerl

Peter Scherl

Andreas Mueller-Hipper

Michael Huber

Erik Heinemann

Wolfgang Schindler

Josef Gruber

Martin Buchsbaum

Josef Heitzer

Andreas Karl

Siegfried Hoffner

Manfred Mengel

Juergen Hoelzl

Stephan Rampetzreiter

Ralph Domnick

Thomas Lehmann

Mathias Belzner

Roman Hollweck

Matthias Gruenauer

Daniel Weiss

Gottfried Beer

Petteri Palm

Berndt Gammel

Guenther Ruhl

Marcus Janke

Alfred Haimerl

Christian Hauser

Walther Pachler

Detlef Houdeau

Bernd Barchmann

Joerg Fischer

Markus Tietke

Josef Mundigl

J&uuml;rgen Fischer

Franz Gabler

Louis Vervoort

Stephan Janka

Bernhard Schaetzler

Kristof Bothe

Uwe Wagner

Thea Goetz

Martin Klimke

Stefan Troelenberg

Mohammed Reza Hussein

An electronic inhalation apparatus including a body having a chip module accommodating region which is at least partially surrounded by a folding structure. When a chip module is accommodated in the chip module accommodating region, the folding structure is bent around the chip module in order to fasten the chip module.

Electronic inhalation apparatus with a chip module fixed with a folding structure

A sensor device including a fingerprint sensor and an antenna. The a fingerprint sensor has a silicon-based area sensor, a sensor area, and an electrically conductive contact region arranged laterally adjacent to the sensor area and configured to be touched upon the contact area being touched by a finger in order to bring the finger to a predetermined potential. The antenna is coupled to the fingerprint sensor to inductively couple the fingerprint sensor to a booster antenna.

Sensor device, method for forming a sensor device, carrier tape, chip card and method for forming a chip card

A tank apparatus for an electronic inhaler, including a receptacle configured to hold a liquid to be vaporized, two supply lines configured to apply an electrical supply voltage to an electrical heater, and an authentication circuit configured to authenticate the tank apparatus. The authentication circuit has two supply terminals configured to apply an electrical supply voltage, and at least one of the supply lines is connectable to at least one of the supply terminals in an electrically conductive manner.

Tank apparatus for an electronic inhalation device, electronic inhalation device and method for authenticating a tank apparatus of an electronic inhalation device

A method for trimming an antenna applied on a carrier, the method including pressing a region of the carrier out from a carrier plane of the carrier, the region having a portion of the antenna and the region being selected according to a target property of the antenna, and removing at least a part of the portion of the antenna from the pressed-out region of the carrier.

Method and device for trimming an antenna applied on a carrier, method for producing a carrier structure, carrier structure and chip card

A sensor device is provided that includes a fingerprint sensor and an antenna coupled with the fingerprint sensor for inductive coupling of the fingerprint sensor with a booster antenna.

Sensor device, method of forming a sensor device, chip card and method of forming a chip card

A package including a frame having an opening for receiving a sensor module, wherein the frame comprises at least one electrical connection which is directed into the opening and which is arranged on an insulation layer applied to the frame, and wherein the insulation layer is connected to the frame at an insertion side of the frame, from which side the sensor module is to be inserted into the opening, and is bent along the inner side of the frame proceeding from the insertion side, such that the at least one electrical connection directed to the opening is electrically couplable to the associated sensor module connection in an arrangement.

Package, method for forming a package, carrier tape, chip card and method for forming a carrier tape

Electrical contact

In various exemplary embodiments, a smart card module is provided. The smart card module includes a carrier and a layer stack at least partly covering the carrier. The layer stack includes a reflection layer, a light-transmissive layer arranged above the reflection layer, and a partly light-transmissive silver layer arranged above the light-transmissive layer. The partly light-transmissive silver layer is configured for reflecting part of light impinging on the partly light-transmissive silver layer.

Smart card module, method for producing a smart card module, smart card and method for testing a smart card module

In various embodiments, a chip card module is provided. The chip card module includes a chip card module contact array having six contact pads that are arranged in two rows having three contact pads each in accordance with ISO 7816, and three additional contact pads that are arranged between the two rows. Each additional contact pad is electrically conductively connected to a respective associated contact pad from a row from the two rows.

Chip card module and method for producing a chip card module

Various embodiments provide a communication module having a carrier, a loop antenna, a modulation circuit which is coupled to the loop antenna and is configured to modulate or demodulate signals which are received or transmitted using the loop antenna, and an impedance matching circuit for matching the impedance of the loop antenna to the input impedance of the modulation circuit. The modulation circuit and the impedance matching circuit are arranged inside the loop antenna on or in the carrier.

Communication module

A method for producing a smart card module arrangement includes: arranging a smart card module on a first carrier layer, wherein the first carrier layer is free of a prefabricated smart card module receptacle cutout for receiving the smart card module. The smart card module includes: a substrate; a chip on the substrate; a first mechanical reinforcement structure between the chip and the substrate. The first mechanical reinforcement structure covers at least one part of a surface of the chip. The method further includes applying a second carrier layer to the smart card module, wherein the second carrier layer is free of a prefabricated smart card module receptacle cutout for receiving the smart card module; and at least one of laminating or pressing the first carrier layer with the second carrier layer, such that the smart card module is enclosed by the first carrier layer and the second carrier layer.

Smart card module arrangement, smart card, method for producing a smart card module arrangement and method for producing a smart card

A chip card is provided. The chip card may include a chip card substrate and an antenna structure disposed in or over the chip card substrate, the antenna structure including a wire arranged to form a first antenna portion configured to contactlessly couple to a chip card external device and a second antenna portion configured to couple to a chip antenna, wherein the wire may include an electrically conductive material coated with an electrically insulating material, wherein the wire of the first antenna portion may be arranged such that a direction of laying progress of the wire of at least some adjacent wire portions are opposite to each other, such that the at least some adjacent wire portions may form a capacitor, wherein the isolation material of the at least some adjacent wire portions may be physically contacting each other.

Chip card and method of forming a chip card

A chip card module is provided. The chip card module may include a carrier having a first side and an opposite second side, a chip arranged over the carrier, the chip having a first chip contact, a first and a second antenna contact formed over the first side, a metal-free area formed over the first side between the first antenna contact and the second antenna contact, wherein the metal-free area extends between a first edge portion and a second edge portion of the carrier, and a first chip connection electrically connecting the first chip contact to the first antenna contact, wherein the first chip connection is at least partially arranged over the second side in a region opposite the metal-free area.

Chip card module, chip card, chip card arrangement, method of forming a chip card module, and method of forming a chip card

One embodiment describes a chip arrangement having a chip carrier; a chip which is arranged in or on the chip carrier; a light sensor arrangement; a transparent layer which covers the light sensor arrangement, the light sensor arrangement being set up to determine a light pattern of light received by the light sensor arrangement from outside the chip arrangement through the transparent layer; and a test circuit which is set up to check whether the light pattern matches a reference light pattern and to output a signal on the basis of the result of the check.

Chip arrangement and method for checking whether a chip is arranged in an intended chip carrier

In various embodiments, a smart card module is provided. The smart card module may include an electronic circuit in or on a carrier, a smart card module contact layer, which is coupled to the electronic circuit and provides a plurality of smart card module contacts, a mirror layer on the smart card module contact layer, said mirror layer at least partly covering the smart card module contacts, and an optically translucent, electrically conductive oxide layer, which covers the mirror layer. The optically translucent, electrically conductive oxide layer includes a plurality of regions of different layer thicknesses for providing different color components.

Multicolored logo on smart card modules

Growing community of inventors

Kelheim, Germany

Frank Pueschner