Analog Devices Global

Frank Poucher

Colin Gerard Lyden

Padraig Fitzgerald

Oliver J Kierse

Michael J Cusack

Patrick Elebert

A stress shield for a plastic integrated circuit package is disclosed. A shield plate is attached by an adhesive to a top surface of an integrated circuit die such that the shield plate covers less than all of the top surface and leaves bond pads exposed. A molding material is applied over the shield plate and the integrated circuit die. The shield plate shields the integrated circuit die from stresses imparted by the molding material.

Stress shield for integrated circuit package

Physical layouts of ratioed circuit elements, such as transistors, are disclosed. Such layouts can maintain electrical characteristics of the ratioed circuit elements relative to one another in the presence of mechanical stresses applied to an integrated circuit, such as an integrated circuit encapsulated in plastic. The ratioed circuit elements can include first and second composite circuit elements formed of first and second groups of circuit elements, respectively, arranged around a center point. The first group of circuit elements can be arranged on a grid and the second group of circuit elements can include four circuit elements spaced approximately the same distance from the center point. Each of the circuit elements in the second group can be off the grid in at least one dimension. The first and second groups of circuit elements can be arranged around a perimeter of dummy circuit elements in some embodiments.

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Raheen, Ireland

Frank Poucher