Texas Instruments Corporation

Frank Odell Armstrong

Edward Carl Fisher

Bradley Morgan Haskett

Steven Edward Smith

Jwei Wien Liu

John Patrick O'Connor

Ivan Kmecko

Clayton Lee Stevenson

Mark Myron Miller

Daniel C Estabrook

Jane Qian Liu

Jeffrey E Faris

Scott Patrick Overmann

Thomas Johnston

Leatrice Lea Gallman Adams

Brian B Jeffreys

Jeffrey E Farris

An electronic device includes a substrate having a surface, functional metallic traces on a first portion of the surface that are electrically connected to carry current in the electronic device and have a first density, and dummy metallic traces on a second portion of the surface that are electrically isolated from the functional metallic traces and have a second density that is within at least 50% of the first density.

Device with dummy metallic traces

A method includes, before attaching a window assembly to a semiconductor wafer, the semiconductor wafer including a plurality of integrated circuits and each integrated circuit including an electrical connection pad, adhering the window assembly to a carrier fixture. The method further includes, before attaching the window assembly to the semiconductor wafer, removing portions of the window assembly to create removal areas. The method then includes attaching the window assembly to the semiconductor wafer such that the electrical connection pad of each of the plurality of integrated circuits is within a removal area and removing the carrier fixture leaving the window assembly adhered to the semiconductor wafer with the electrical connection pad exposed of each of the plurality of integrated circuits.

Singulation of wafer level packaging

A packaged electronic device includes a substrate with an upper surface interrupted by a well formed in the substrate. The well has a substrate bottom surface and a substrate sidewall. An electronic device is located in the well over the substrate bottom surface and has a device top surface and a device sidewall. A trench is bounded by the substrate bottom surface, the substrate sidewall and the device sidewall. An encapsulant at least partially fills the trench and contacts the substrate sidewall and the device sidewall. The encapsulant has a first elevation on the substrate sidewall with respect to the substrate bottom surface and a second elevation on the substrate device sidewall with respect to the substrate bottom surface that is at least about 35% greater than the first elevation.

Thermal conduction by encapsulation

An improved window frame and window piece for a micromirror assembly is disclosed herein. The window frame includes a stress-relieving contour positioned in the middle of the frame that can absorb the mechanical stresses applied to the window frame from the ceramic base and from the window piece. The window frame may be comprised of a single piece of sheet metal that has been stamped to include a stress-relieving contour. The stress-relieving contour may be comprised of a variety of shapes, including a 'U' shape, an inverted 'U' shape, a curved step shape, or other combinations thereof.

Stress relieved flat frame for DMD window

Stress relieved frame

A device measures air flow at multiple points in an air channel. The device includes a metering plate that has multiple passages through the metering plate. The metering plate is adapted to be positioned across the air channel in an orientation that places two or more of the multiple passages at two or more respective locations within the air channel. The metering plate is also adapted to receive two or more flow meters at the two or more passages, respectively. In addition, the metering plate is configured so that respective air flow velocities at the two or more locations when the metering plate is positioned across the air channel substantially matches air flow velocities at the two or more locations when the metering plate is not positioned across the air channel. An example embodiment includes holders such as sockets that keep the flow meters fixed in the metering plate with regard to pitch and roll.

System and method for measuring air flow at multiple points of an air channel

An improved metal film deposition system is disclosed which comprises an improved shield (80) to prevent particulate contamination of processed wafers. The shield (80) includes an interstitial layer of flame-sprayed metal which adheres well to both the material comprising the metal film and the metal comprising the shield (80). Further, the shield utilizes radiused deflections (84) and (86) to disperse the forces created by the crystalline growth of the metal film.

Methods and systems for shielding in sputtering chambers

Growing community of inventors

Terrell, TX, United States of America

Frank Odell Armstrong