Umicore Galvanotechnik Gmbh

Frank Oberst

Bernd Weyhmueller

Sascha Berger

Klaus Bronder

Uwe Manz

Franz Simon

Philip Schramek

Michael Lauster

Martin Stegmaier

The present invention relates to an electrolyte for the electrochemical deposition of palladium or palladium alloys on metallic or conductive substrates. The invention likewise relates to a corresponding electroplating process using this electrolyte and specific palladium salts which can be advantageously used in this process.

Pd and Pd-Ni electrolyte baths

The present invention relates to a process for preparing palladium complexes. In particular, the present invention relates to a process in which ammoniacal complexes of palladium (hydrogen)carbonate are converted into complexes with oligoamine ligands.

Process for preparing complexes of palladium (hydrogen)carbonate with amine ligands

Consumer goods and industrial articles are electro-plated with bronze layers for decorative reasons and to protect them against corrosion. The electrolytes used hitherto for producing decorative bronze layers are either cyanide-containing or, as in the case of baths based on organosulphonic acids, highly corrosive or have, as in the case of cyanide-free baths based on diphosphoric acid, unsatisfactory long-term stabilities. Electrolytes which are used for applying solderable bronze layers in the electronics industry usually contain toxic or very toxic thio compounds. The present invention provides a non-toxic electrolyte which displays long-term stability for the electrolytic deposition of decorative bronze layers and a corresponding process for the application of such decorative bronze layers to consumer goods and industrial articles.

Copper-tin electrolyte and method for depositing bronze layers

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Schwaebisch Gmuend, Germany

Frank Oberst