Lucent Technologies Inc.

Agere Systems Guardian Corp.

Frank Micelli

William Graham Easter

John A Maze, Iii

Annette Margaret Crevasse

Jose Omar Rodriguez

An apparatus and method for removing a polishing pad from a platen during a CMP process is disclosed. The invention facilitates the removal of a polishing pad from a platen by providing a polishing pad having at least one protuberance portion extending from the main portion of the pad such that the polishing pad may be removed manually or with the assistance of a device by engaging the protuberance portion.

Apparatus and method for removing a polishing pad from a platen

The present invention provides a polishing apparatus having a drive motor, a carrier head and a polishing platen with a magnetic region formed in either the carrier head or the polishing platen. The magnetic region is configured to create an attracting force between the carrier head and the polishing platen. The drive motor is capable of producing a rotational polishing force. The carrier head is configured to retain an object to be polished, while the polishing platen has a polishing pad and is juxtaposed the carrier head.

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Orlando, FL, United States of America

Frank Micelli