Agere Systems Inc.

Lucent Technologies Inc.

Agere Systems Guardian Corp.

Frank Miceli

William Graham Easter

John Albert Maze, Iii

Annette Margaret Crevasse

John A Maze, Iii

Jose Omar Rodriguez

Sailesh Mansinh Merchant

Alvaro Maury

Charles A Storey

Andres B Garcia

Margareth Seputro

Dale Evans

Sudhanshu Misra

Arun Kumar Nanda

Charles Walter Pearce

Allen Yen

Yifeng Winston Yan

Richardson O Adebanjo

Yifeng Winston Yang

Subramanian Karthikeyan

Dale Delano Evans

Robert M Symons

Fook Loong Chin

Craig R Zavilla

Dale D Evans

A method and system are provided using an offset dial gage for alignment and adjustment of a polishing pad that has been attached to a turntable of a chemical mechanical polishing (CMP) device. In a described embodiment, an offset dial gage has a surface that contacts a side of a turntable, while a sensor tip contacts the edge of a polishing pad positioned on the turntable. This provides an assessment of radial displacement of the polishing pad edge at this measurement point relative to the side of the turntable. Based on one or more such measurements, the polishing pad may be found acceptably positioned, may be trimmed, or may be replaced. The method and system reduce or eliminate the occurrence of a defect pattern found to be related to side unloading of semiconductor wafers from a CMP turntable.

System of using offset gage for CMP polishing pad alignment and adjustment

Method and system of using offset gage for CMP polishing pad alignment and adjustment

Disclosed herein is a process for diminishing contamination of an integrated circuit wafer caused by residual slurry components disposed on a back side of a carrier for engaging an integrated circuit wafer. Also disclosed is a CMP machine configured to wash a back side of a carrier.

Method and apparatus for cleaning slurry depositions from a water carrier

The present invention, in one embodiment, provides a method for eliminating agglomerate particles in a polishing slurry. In this particular embodiment, the method is directed to reducing agglomeration of slurry particles within a waste slurry passing through a slurry system drain. The method comprises conveying the waste slurry to the drain, wherein the waste slurry may form an agglomerate having an agglomerate particle size. The method further comprises subjecting the waste slurry to energy emanating from an energy source. The energy source thereby transfers energy to the waste slurry to substantially reduce the agglomerate particle size. Substantially reduce means that the agglomerate is size is reduced such that the waste slurry is free to flow through the drain.

Method of eliminating agglomerate particles in a polishing slurry

The present invention provides a polishing endpoint detection system, for use with a polishing apparatus, a method of determining a polishing endpoint of a surface located on a semiconductor wafer, and a method of manufacturing an integrated circuit on a semiconductor wafer. In one embodiment, the polishing endpoint detection system includes a carrier head having a polishing platen associated therewith. Also, the detection system includes a signal emitter located adjacent one of the carrier head or polishing platen. The signal emitter is configured to generate an emitted signal capable of traveling through an object to be polished. In addition, the detection system includes a signal receiver located adjacent another of the carrier head or polishing platen. The signal receiver is configured to receive the emitted signal from which a change in a signal intensity of the emitted signal can be determined.

System and method of determining a polishing endpoint by monitoring signal intensity

A connector and associated method for interconnecting a plurality of adjacent paired wire terminations on a standard 110 style punch down wiring block for a telephone system. The connector includes two isolated conductors disposed along the length of the connector body and a plurality of pins connected to the respective conductors and extending away from the body. The pins are adapted for insertion into respective 110 style punch down block terminations when the connector is installed in a connected position on the wiring block, thereby connecting in parallel a plurality of telephones hard-wired to the adjacent paired wire terminations. The connector may be formed to have one or more break points disposed between respective pairs of the pins for easy breaking/cutting of the connector to a desired length for interconnecting a predetermined number of telephones. The connector may further include pairs of legs formed on opposed sides of the pins, with each leg having an indentation for receiving a mating projection formed on the wiring block for snap connection to the wiring block.

Analog phone bank connector

The present invention provides a method for manufacturing an integrated circuit using a polishing head in a polishing apparatus. In one advantageous embodiment, the polishing head comprises a wafer carrier having an outer periphery and a wafer holder. The wafer holder is coupled to the wafer carrier and depends from the outer periphery thereof. The wafer holder is configured (i.e., designed) to grip an edge of the semiconductor wafer.

Polishing carrier head

The present invention provides a polishing head, for use with a polishing apparatus. In one embodiment, the polishing head includes a carrier head assembly, and a retaining ring having a surface positionable adjacent a polishing pad and couplable to the carrier head assembly and configured to retain a semiconductor wafer therein, the retaining ring having a slurry conduit located therethrough to provide a flow of slurry to the polishing pad.

Polishing head for pressurized delivery of slurry

The present invention provides a wafer cleaning apparatus. In an advantageous embodiment, the wafer cleaning apparatus includes cleaning brushes mounted within a brush box and a sensor associated with at least one of the cleaning brushes and configured to detect a degree of wetness of the at least one of the cleaning brushes. In most cases, the cleaning brushes are comprised of an absorbent material, such as polyvinyl alcohol, that becomes more compressible as the cleaning brushes become more wetted with a solution. Thus, a degree of compressibility can be related to a degree of wetness of a cleaning brush, which provides data that allows an operator to determine when the cleaning brushes are wet enough to send a wafer through the cleaning apparatus without incurring unnecessary damage.

Apparatus for detecting wetness of a semiconductor wafer cleaning brush

The present invention provides a method of manufacturing an integrated circuit using a cleaning brush and a cleaning brush conditioning apparatus. In one embodiment, the cleaning brush conditioning apparatus comprises a conditioning bar and a load cell coupled to the conditioning bar. The load cell is configured to force the conditioning bar against the cleaning brush.

Cleaning brush conditioning apparatus

The present invention provides a polishing slurry reclamation system. In one embodiment, the polishing slurry reclamation system comprises a polishing apparatus having a polishing platen and a fluid delivery system positioned to deliver a slurry or a rinse to the polishing platen, a recovery drain adjacent the polishing platen, and a fluid diverter associated with the platen and configured to deflect a selected one of a slurry or rinse emanating from the polishing platen to the recovery drain.

Apparatus and method for reclamation of used polishing slurry

A method of cleaning a semiconductor wafer using a cleaning brush assembly having an arbor with: (1) an expandable member configured to have a non-expanded position and an expanded position, and (2) a cleaning brush, located about the expandable member, having an inner diameter greater than an outer diameter of the expandable member in the non-expanded position and less than an outer diameter of the expandable member in the expanded position.

Method of cleaning a semiconductor wafer with a cleaning brush assembly having a contractible and expandable arbor

The present invention relates to an apparatus and method for polishing substrate surfaces. The method can include the steps of holding a substrate against a polishing surface and depositing slurry on the polishing surface. The method can further include the step of moving the holding device in a substantially curvilinear path relative to the polishing surface, or the step of moving the polishing surface in a substantially curvilinear path relative to the holding device. The apparatus comprises a polishing surface, a holding device for holding a substrate against the polishing surface, and a slurry supply system for depositing slurry on the polishing surface. The apparatus further includes a moving structure for moving the holding device in a substantially curvilinear path along the polishing surface, or a moving structure for moving the polishing surface in a substantially curvilinear path relative to the holding device. The substantially curvilinear path is preferably substantially a figure eight path.

Curvilinear chemical mechanical planarization device and method

A method of manufacturing a semiconductor device employing a polishing pad conditioner that directs a fluid stream at a polishing pad to remove accumulated material from the pad. The fluid stream may contact a large area of the polishing pad or a smaller area where the fluid stream is moved to condition different areas of the polishing pad. The fluid stream may include abrasive particles to promote the removal of the accumulated materials. The velocity of the fluid stream may be increased or decreased to promote removal of the accumulated materials. In yet another embodiment, the present invention is directed to a process for manufacturing an integrated circuit using a CMP process where the pad has been conditioned using the fluid stream. The present invention is also directed to a chemical mechanical planarization system including a pad conditioner.

Chemical mechanical polisher including a pad conditioner and a method of manufacturing an integrated circuit using the chemical mechanical polisher

A computer system for a motion impaired user includes a housing, a processor in the housing, and a display connected to the processor for displaying at least one menu of selectable commands arranged in a sequence. A mouse is connected to the processor for positioning a pointer on the display responsive to movement of the mouse. The computer further includes a mouse template having at least one elongate body having a plurality of stations therealong corresponding to the sequence of selectable commands and cooperates with the mouse for assisting the motion impaired user so that when the mouse is positioned at a station, the pointer on the display is positioned at the corresponding selectable command of the menu.

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Orlando, FL, United States of America

Frank Miceli