Infineon Technologies Ag

Finisar Corporation

Frank Meyer-Güldner

Daniel Reznik

Jörg-Reinhardt Kropp

Mathias Grumm

Georg Jeiter

The electro-optical module has a substrate with a mounting surface that is free from depressions. A surface-mounted component unit is disosed on the mounting surface. The component unit contains as integral components an electro-optical component and a lens which are aligned directly with one another. The surface serves, furthermore, as a reference plane for assembling a receptacle for an optical fiber plug.

Electro-optical module

The device has a package with a base plate, and at least two terminal pins perpendicularly protruding from the base plate of the package. At least one of the terminal pins is a high-frequency terminal pin that transmits a high-frequency signal. The device has a flexible conductor arrangement with a plurality of interconnects. The conductor arrangement provides an electrical connection between the terminal pins of the package and electrical contacts of a printed circuit board. The conductor arrangement has contact regions for electrically connecting the interconnects to a terminal pin and to a contact of a printed circuit board. At least the region of the conductor arrangement that provides a connection to high-frequency terminal pin lies in a plane aligned substantially perpendicular to the plane of the base plate.

Device for connecting the terminal pins of a package for an optical transmitting and/or receiving device to a printed circuit board and conductor arrangement for such a device

Growing community of inventors

Berlin, Germany

Frank Meyer-Güldner