International Business Machines Corporation

Frank Louis Pompeo

Hilton T Toy

Mukta G Farooq

David L Edwards

Sushumna Iruvanti

Patrick Anthony Coico

Jeffrey Allen Zitz

Jeffrey Donald Gelorme

Thomas Edward Lombardi

David C Linnell

Michael J Ellsworth, Jr

Michael A Gaynes

Benjamin V Fasano

Shaji Farooq

Lewis Sigmund Goldmann

Glenn Graham Daves

Mark G Courtney

Sri Muthuthamby Sri-Jayantha

Stephen L Buchwalter

David L Questad

James L Speidell

Subhash Laxman Shinde

Anson Jay Call

Raed A Sherif

Son K Tran

William Edward Sablinski

Marie-Claude Paquet

Jeffrey Thomas Coffin

Jay A Bunt

Robert P Kuder, Ii

David J Lewison

Daniel J Littrell

David Clifford Long

Alan Frederic Benner

Sudipta Kumar Ray

How Tzu Lin

Peter Jeffrey Brofman

Raymond A Jackson

Kathleen Ann Stalter

Harvey Charles Hamel

Jason Lee Frankel

James H Covell

Hongqing Zhang

Suresh D Kadakia

Gregory Blair Martin

Joyce E Molinelli Acocella

Ray A Jackson

Evan G Colgan

Wayne Martin Moreau

Mark Kenneth Hoffmeyer

Prabjit Singh

Phillip Duane Isaacs

Mario John Interrante

Steven Paul Ostrander

Laura Louise Kosbar

Kenneth Charles Marston

Ali Afzali-ardakani

Christopher Michael Marroquin

Jason R Eagle

John Blake Pavelka

Steve Ostrander

Sundar M Kamath

Ronald L Hering

Armando S Cammarano

Stephen S Drofitz, Jr

Karl Joseph Puttlitz

Daren Simmons

Bert H Newman

Joseph Ying-Yuen Chan

Stanley J Jasne

Lewis S Goldman

Stephen H Meisner

Paul Anthony Zucco

John Ulrich Knickerbocker

Da-Yuan Shih

Krishna Gandhi Sachdev

James A Busby

Sung Kwon Kang

Bruce Kenneth Furman

John Harold Magerlein

Donald W Henderson

Phong T Tran

Daniel J Stigliani, Jr

Michael Berger

Madhana Sunder

Richard W Oldrey

Jiali Wu

John D Sylvestri

Jaimal M Williamson

Alain A Caron

Apparatuses and methods of fabrication are provided which include a coolant-cooled heat sink through which coolant passes to facilitate cooling the coolant-cooled heat sink, and an ultra-violet (UV) light assembly associated with the coolant-cooled heat sink for directing UV light towards an interior surface of the coolant-cooled heat sink across which the coolant passes. The UV light inhibits bacterial growth at the interior surface of the coolant-cooled heat sink.

Coolant-cooled heat sink(s) with associated ultra-violet light assembly

A method of preparing a computer processor die includes determining a warpage shape of the computer processor die at a testing temperature. The method also includes selectively contouring a thickness of the computer processor die at a contouring temperature by physically removing material from a surface of the computer processor die such that the surface will be substantially flat at the testing temperature.

High power device fault localization via die surface contouring

A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.

Fixture facilitating heat sink fabrication

Coolant-cooled heat sinks and methods of fabrication are provided with a coolant-carrying compartment between a cover and a heat transfer base. The heat transfer base includes a heat transfer surface to couple to a component to be cooled, and a plurality of thermally-conductive fins extending into the coolant-carrying compartment from a surface of the heat transfer base opposite to the heat transfer surface. One or more grooves are provided in an interface surface of the cover and fins, and wicking element(s) are positioned within, at least in part, the groove(s). A joining material is provided between the cover and fins to join the plurality of thermally-conductive fins to the cover. The wicking element(s) within, at least in part, the groove(s) facilitate retaining the joining material over the plurality of thermally-conductive fins during joining of the cover and fins.

Coolant-cooled heat sinks with internal thermally-conductive fins joined to the cover

Methods of producing coolant-cooled heat sinks with a coolant-carrying compartment between a cover and a heat transfer base are provided. The heat transfer base includes a heat transfer surface to couple to a component to be cooled, and a plurality of thermally-conductive fins extending into the coolant-carrying compartment from a surface of the heat transfer base opposite to the heat transfer surface. The method includes positioning a screen with openings over the plurality of thermally-conductive fins, between the plurality of thermally-conductive fins and the cover, and providing a joining material over the screen, between the screen and the cover. The method also includes joining the plurality of thermally-conductive fins to the cover across the screen using the joining material, where the screen facilitates retaining the joining material over the plurality of thermally-conductive fins during the joining.

Fabricating coolant-cooled heat sinks with internal thermally-conductive fins

An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.

Method and apparatus for strain relieving surface mount attached connectors

The present invention provides chip containing electronic devices such as Multichip Ceramic Modules (MCM's) containing a plurality of chips on a substrate which chips are underfilled with a reworkable composition which allows one or more chips to be removed from the device and replaced. The reworkable compositions contain a base resin which is not cross-linkable and which forms a matrix with a linear curable component or preferably a combination of linear curable components which curable components are cross-linkable and when cured form a cross-linked domain in the base resin matrix. A suitable cross-linking catalyst such as Pt is used and optionally a filler preferably silane surface treated silica. The preferred base resin is linear polydimethylsiloxane and the preferred curable components are vinyl terminated linear poly dimethyl siloxane and hydrogen terminated linear poly dimethyl siloxane.

Reworkable underfills for ceramic MCM C4 protection

A method for assembling, and the resultant electronic module, includes attaching a chip to a substrate using a first solder interconnection array, and attaching a board to the substrate using a second solder interconnection array, which may be a single-melt or a dual-melt solder array. The second solder interconnection array resides entirely within a space defined between the board and substrate. A creep resistant structure is provided within this space for maintaining the defined space and optimizing integrity of the second solder interconnection array. The creep resistant structure may include an underfill material, balls, brackets, frames, collars or combinations thereof. Wherein the creep resistant structure is an underfill material, it is crucial that the substrate be attached to the board before either entirely encapsulating the second interconnection array with underfill material, or partially encapsulating the second solder interconnection array at discrete locations with underfill material.

Solder interconnection array with optimal mechanical integrity

Disclosed is an apparatus for separating interconnects between, for example, a card and a substrate. The apparatus includes one or more rotationally biased (e.g., spring-loaded, etc.) partial-circle structures (e.g., blades, squeegee, plow, etc.) and one or more temperature-sensitive releases connected to the partial-circle structures. The partial-circle structures are positioned to rotate and separate the interconnects when released by the temperature-sensitive releases. The invention can also include solder reservoirs positioned to receive solder from the interconnects separated by the partial-circle structures.

Apparatus for removing interconnects to separate two parts of a workpiece

A tamper resistant, integrated circuit (IC) module includes a ceramic-based chip carrier; one or more integrated circuit chips attached to a top surface of the chip carrier; a ceramic-based cap structure attached to the top surface of the chip carrier, and covering the one or more integrated circuit chips; and a conductive grid structure embedded within the chip carrier and the cap structure, the conductive grid structure having a plurality of meandering lines disposed in an x-direction, a y-direction, and a z-direction; wherein the conductive grid structure is configured so as to detect an attempt to penetrate the IC module.

Structure for implementing secure multichip modules for encryption applications

An optoelectronic assembly for an electronic system includes a thermally conductive, metallized transparent substrate having a first surface and an opposite second surface. A support chip set is bonded to the transparent substrate. A first substrate is in communication with the transparent substrate via the second surface and support chip set therebetween. A second substrate is in communication with the second surface of the first substrate and is configured for mounting at least one of data processing, data switching and data storage chips. An optoelectronic transducer is in signal communication with the support chip set, and an optical signaling medium having one end with an optical fiber array aligned with the transducer is substantially normal to the first surface of the transparent substrate. The support chip set and the transducer share a common thermal path for cooling.

Method and apparatus for providing optoelectronic communication with an electronic device

Growing community of inventors

Redding, CT, United States of America

Frank Louis Pompeo