Micron Technology Incorporated

Frank L Hall

Cary J Baerlocher

Bret K Street

James M Derderian

Tongbi T Jiang

Jason L Fuller

Todd O Bolken

William Jeffery Reeder

James L Voelz

Michael D Chase

An apparatus and method may be used for packaging a semiconductor die and a carrier substrate to substantially prevent trapped moisture therebetween and provide a robust, inflexible cost-effective bond. The semiconductor die is attached to the carrier substrate with a plurality of discrete adhesive elements so as to provide a gap or standoff therebetween. Wire bonds may then be formed between bond pads on the semiconductor die to conductive pads or terminals on the carrier substrate. With this arrangement, a dielectric filler material is disposed in the gap or standoff to form a permanent bonding agent between the semiconductor die and the carrier substrate. By applying the dielectric filler material after forming the wire bonds, the dielectric filler material coats at least a portion of the wire bonds to stabilize the wire bonds and prevent wire sweep in an encapsulation process, such as transfer molding, performed thereafter.

Underfilled semiconductor die assemblies and methods of forming the same

A method of forming molding standoff structures on integrated circuit devices is disclosed which includes forming a plurality of standoff structures on a substantially rectangular sheet of transparent material and, after forming the standoff structures, singulating the substantially rectangular sheet of transparent material into a plurality of individual transparent members, each of which comprise at least one of the plurality of standoff structures.

Method of forming molded standoff structures on integrated circuit devices

Integrated circuit packages that connect solder balls between solder ball pads of a die and substrate pads of a printed circuit board (PCB). The solder balls are electrically disconnected from any circuit of the die, i.e., 'dummy' solder balls, and are used to temporarily hold the die in position with respect to the PCB until the circuit is wire bonded and an underfill material is cured between the die and the PCB to more permanently connect them together. The underfill material is selected to have a coefficient of thermal expansion (CTE) that is substantially equal to the CTE of the solder balls to prevent thermal mismatch problems. An overmolding compound is disposed about the die and the underfill material and about the wire bonds to complete the package. Various arrangements of the solder ball pads on the die include columnar and row, corner, diagonal, cross, and periphery arrangements.

Semiconductor integrated circuit package having electrically disconnected solder balls for mounting

A method and apparatus for assembling and packaging semiconductor die assemblies utilizes a coating element such as a wafer back side laminate formed on a back side of a semiconductor die is disclosed. The coating element may be formed from a somewhat compressible and, optionally, resilient material, which seals against a surface of a mold cavity while the semiconductor die assembly is being encapsulated. In this manner, the coating element prevents encapsulant material from covering at least a portion of the back side of the semiconductor die to prevent encapsulant flashing over the back side and thus improve heat dissipation characteristics of the packaged semiconductor die during operation.

Apparatus for molding a semiconductor die package with enhanced thermal conductivity

Methods for manufacturing microelectronic imaging units and microelectronic imaging units that are formed using such methods are disclosed herein. In one embodiment, a method for manufacturing a plurality of microelectronic imaging units includes placing a plurality of singulated imaging dies on a support member. The individual imaging dies include a first height, an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The method further includes electrically connecting the external contacts of the imaging dies to corresponding terminals on the support member and forming a base on the support member between adjacent imaging dies. The base has a second height less than or approximately equal to the first height of the dies. The method further includes attaching a plurality of covers to the base so that the covers are positioned over corresponding image sensors.

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

An electronic device package is described that includes a non-metal die attached adhesive. The die attach is positioned in discrete positions on a surface to which the die will be fixed. The die is placed on the discrete die attach. The die attach, in an embodiment, is an epoxy resin or other material that is cured. After curing, the die is electrically connected to an external circuit. The volume between the die and surface is filled with an underfill. In an embodiment, underfill cross-links with the die attach.

Electronic device package

Microelectronic imaging units and methods for manufacturing microelectronic imaging units are disclosed herein. In one embodiment, a method includes placing a plurality of singulated imaging dies on a support member. The individual imaging dies include an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The method further includes disposing a plurality of discrete stand-offs on the support member. The discrete stand-offs are arranged in arrays relative to corresponding imaging dies. The method further includes electrically connecting the external contacts of the imaging dies to corresponding terminals on the support member, and attaching a plurality of covers to corresponding stand-off arrays so that the covers are positioned over the image sensors.

Methods of manufacturing microelectronic imaging units with discrete standoffs

Methods of fabricating underfilled, encapsulated semiconductor die assemblies

An apparatus and method for packaging a semiconductor die and a carrier substrate to substantially prevent trapped moisture therebetween and provide a robust, inflexible cost-effective bond. The semiconductor die is attached to the carrier substrate with a plurality of discrete adhesive elements so as to provide a gap or standoff therebetween. Wire bonds may then be formed between bond pads on the semiconductor die to conductive pads or terminals on the carrier substrate. With this arrangement, a dielectric filler material is disposed in the gap or standoff to form a permanent bonding agent between the semiconductor die and the carrier substrate. By applying the dielectric filler material after forming the wire bonds, the dielectric filler material coats at least a portion of the wire bonds to stabilize the wire bonds and prevent wire sweep in an encapsulation process, such as transfer molding, performed thereafter.

Growing community of inventors

Boise, ID, United States of America

Frank L Hall