Smartrac Technology Gmbh

Other

Dresden Gmbh

Ksw Microtec Ag

Linxens Holding Sas

Frank Kriebel

Carsten Nieland

Laurence Singleton

Robert Semar

Hannes Kullig

Thomas Seidowski

Stephan Dorn

Martin Häring

Hannes Kuellig

The invention relates to a contact bump connection () and to a method for producing a contact bump connection between an electronic component being provided with at least one terminal face () and a contact substrate () being contacted with the component and having at least one second terminal face (), wherein the first terminal face is provided with a contact bump (), which has a raised edge () and has at least one displacement pin () in a displacement compartment () being surrounded by the raised edge and being open towards a head end of the contact bump, and wherein, in a contact region () with the first terminal face, the second terminal face has a contact bead (), which is formed by displacement of a contact material () of the second terminal face into the displacement compartment and which surrounds the displacement pin, said contact bead having a bead crown () which is oriented to a bottom () of the displacement compartment and is raised relative to a level contact surface () of the second terminal face surrounding the contact region.

Contact bump connection and contact bump and method for producing a contact bump connection

The invention relates to a method for producing chips () by dividing a wafer along dividing lines () defining dimensions of the chip, wherein a focus () of a preferably pulsed laser radiation () is moved along the dividing lines on a first and at least a second path () within the wafer body, wherein the laser radiation is applied to the wafer from a rear side () of the wafer, and the power density for producing the defects () on the first path () is lower than the power density for producing the defects () on the second path (), and/or the number of defects on the first path is smaller than the number of defects on the second path.

Method of separating chips from a wafer

Contact bumps between a contact pad and a substrate can include recesses and protrusions that can mate with the material of the substrate. The irregular mating surfaces between the contact bumps and the contact pads can enhance the bonding strength of the contacts, for example, against shear and tension forces, especially for flexible systems such as smart cards.

Contact bumps methods of making contact bumps

A magnetic-guiding laminate is used to improve wireless communication between a transmitter and a receptor disposed on a substrate, regardless of the substrate materials. The laminate can comprise one or more layers of magnetic or non-magnetic material with different magnetic property. For example, the laminate can comprise a paramagnetic layer disposed on a diamagnetic layer, where the paramagnetic layer attracts the magnetic field toward the RFID antenna, and the diamagnetic layer prevents the magnetic field from dispersing in the substrate. Alternatively, the laminate can comprise multiple paramagnetic layers, wherein at least two layers have different magnetic properties, such as different permeability values.

RFID electronic label

A radio frequency device comprises a radio frequency transponder having a radio frequency circuit and a radio frequency antenna, and a sensor conductively connected to the radio frequency antenna so that a measurement can be retrieved from the sensor by communicating with the transponder. The radio frequency antenna comprises a first portion which is used primarily for receiving and/or sending of radio frequency signals, and a second portion which is used primarily for conductively connecting the sensor to the first portion of the radio frequency antenna and which enables placing the sensor in a spaced-apart spatial relation to the first portion of the radio frequency antenna.

Growing community of inventors

Lichtenberg, Germany

Frank Kriebel