Amkor Technology, Inc.

Frank Joseph Juskey

Ronald Patrick Huemoeller

Christopher Marc Scanlan

Ronald James Schoonejongen

Jonathon Greenwood

Anthony LoBianco

John R McMillan

Pat O'Brien

Thomas P Glenn

Vincent DiCaprio

Stephen Gregory Shermer

Ron Ellenberger

A method includes modifying wettable regions of a leadframe with a laser to form non wettable barriers. Wettable pads are defined with the non wettable barriers. Since the non wettable barriers are formed in a single automated step with the laser, the non wettable barriers are formed at low cost. During flip chip mounting of an electronic component to the leadframe, the non wettable barriers confine solder to the wettable pads. This results in consistent and reliable solder bump formation.

Laser defined pads for flip chip on leadframe package fabrication method

A leadframe includes a lead. The lead includes a wettable pad and a wettable lead surface. A non wettable barrier separates the wettable pad from the wettable lead surface, the non wettable barrier being formed from a modified portion of the leadframe. Solder wets only the wettable pad during formation of a solder bump between the wettable pad and a bond pad of electronic component flip chip mounted to the leadframe. This results in consistent and reliable solder bump formation. Further, the non wettable barrier is formed in a single automated step with a laser and thus at low cost.

Laser defined pads for flip chip on leadframe package

A package includes both a flip chip mounted active chip component and a passive chip component. To form the package, a solder paste is screened onto a passive chip component contact on an upper surface of a substrate. A terminal of the passive chip component is aligned with the solder paste. The solder paste is melted to form a solder joint between the passive chip component contact and the terminal. Solder flux residue from the solder paste is removed. A solder bump is formed on a bond pad of an active chip component. The solder bump is aligned with an active chip component contact on the upper surface of the substrate. The solder bump is melted to form a bump between the active chip component contact and the bond pad, wherein the solder joint does not melt during the melting of the solder bump.

Flip chip integrated circuit and passive chip component package fabrication method

A method for overmolding a ceramic substrate for a semiconductor chip or other electrical device, and a resulting package, are disclosed. In one embodiment, plural ceramic substrate panels having a matrix of semiconductor chips thereon are precisely located on and attached to a temporary support member using an alignment tool. The member and the attached ceramic substrate panels are then placed in a mold tool. When the mold tool is closed, it clamps down on the member around the ceramic substrate panel, and not on the ceramic substrate panel itself. A mold compound injected into the mold tool encapsulates the chips and ceramic substrate panels. Subsequently, packages each containing a chip are singulated from the encapsulated ceramic substrate panels.

Method for molding semiconductor package having a ceramic substrate

A low-cost printed circuit board for a semiconductor package having the footprint of a ball grid array package has an integral heat sink, or &ldquo;slug,&rdquo; for the mounting of one or more semiconductor chips, capable of efficiently conducting away at least five watts from the package in typical applications. It is made by forming an opening through a sheet, or substrate, of B-stage epoxy/fiberglass composite, or &ldquo;pre-preg,&rdquo; then inserting a slug of a thermally conductive material having the same size and shape as the opening into the opening. The slug-containing composite is sandwiched between two thin layers of a conductive metal, preferably copper, and the resulting sandwich is simultaneously pressed and heated between the platen of a heated press. The heat and pressure forces the resin to the surface of the composite and into the space between the slug and the walls of the composite, where it solidifies, bonding the edges of the slug to the substrate within the opening and adhering the conductive layers to the upper and lower surfaces of the substrate. The resulting laminate can thereafter be processed as a convention printed circuit board to incorporate conventional circuit board features, e.g., circuit traces, wire bonding pads, solder ball mounting lands, and via holes.

Printed circuit board with integral heat sink for semiconductor package

Apparatus for attaching multiple metal components to integrated circuit modules reduces manufacturing time for module assemblies having metal shields and/or heat sinks that must be applied to multiple modules within a manufacturing assembly. The metal components are manufactured in an array and the array assembly is attached to the integrated circuit substrate. The metal component array is then divided along with the modules after attachment. The modules are sawed apart before or after attachment. A reduction in manufacturing time is achieved through multiple placement of the metal components rather than individual placement.

Method and apparatus for attaching multiple metal components to integrated circuit modules

A package includes both a flip chip mounted active Chip component and a passive chip component. The flip chip bumps between the bond pads of the active chip component and the substrate are low impedance. Further, by mounting the active chip component as a flip chip, the area on the substrate occupied by the active chip component is approximately equal to the area of the active chip component.

Electronic package having flip chip integrated circuit and passive chip component

This invention provides a method for making a semiconductor package with stacked dies that substantially reduces risk of fracturing of the dies and prevents breakage of the wire bonds caused by wire sweep. One embodiment of the method includes the provision of a substrate and a pair of semiconductor dies, each having opposite top and bottom surfaces and a plurality of wire bonding pads around the peripheries of their respective top surfaces. One die is attached and wire bonded to a top surface of the substrate. A measured quantity of an uncured, fluid adhesive is dispensed onto the top surface of the first die, and the adhesive is squeezed out to the edges of the dies by pressing the bottom surface of the second die down onto the adhesive until the two dies are separated by a layer of the adhesive. The adhesive is cured and the second die is wire bonded to the substrate. A bead of an adhesive is dispensed around the periphery of the dies such that it covers the wire bonds and bonding pads on the second die. A plastic body is molded over the dies and the bead of adhesive. The bead of adhesive prevents bending or breakage of the wire bonds caused by wire sweep during the subsequent molding operation.

Growing community of inventors

Phoenix, AZ, United States of America

Frank Joseph Juskey