Stmicroelectronics Gmbh

Stmicroelectronics International N.v.

Sgs-thomson Microelectronics Limited

Frank J Sigmund

Michael J Hundt

Krishnan Kelappan

Haibin Du

K R Hariharasudhan

David C McClure

Frank R Bryant

Mark A Lysinger

Robert L Hodges

Dale Thomas Moore

Fred Chevreton

John A Michlowsky

An electronic device includes a processor coupled to a battery and to determine whether the battery is being charged or discharged. If the battery being is being discharged, the processor operates to calculate an amount by which the battery has discharged since a preceding calculation of remaining capacity of the battery, compensate the amount by which the battery has discharged for a condition of the battery, and calculate a remaining capacity of the battery as a function of the amount by which the battery has discharged. If the battery is being charged, the processor operates to calculate an amount by which the battery has charged since a preceding calculation of remaining capacity of the battery, compensate the amount by which the battery has charged for a condition of the battery, and calculate the remaining capacity of the battery as a function of the amount by which the battery has charged.

Battery pack management

A battery pack management system provides information such as remaining capacity and/or run time to empty for a battery. A time taken for a battery voltage to drop a threshold amount is measured and used to determine a remaining capacity of the battery. The time may be associated with a temperature and current of the battery. The remaining capacity of a battery is calculated by monitoring a discharge of the battery. For example, current drawn from the battery is monitored over a period of time and an initial amount by which the battery has been discharged is calculated. Compensation of this initial amount is carried out in order to take into account factors such as temperature, self-discharge rate and age of the battery.

An integrated circuit package is provided with a thin-film battery electrically connected to and encapsulated with an integrated circuit die. The battery can be fabricated on a dedicated substrate, on the die pad, or on the integrated circuit die itself.

Integrated circuit package including embedded thin-film battery

An apparatus includes a display panel capable of displaying content. The apparatus also includes a light sensor having an integrated circuit and a photo-sensitive device. The photo-sensitive device is capable of measuring an amount of ambient light. The integrated circuit is capable of performing one or more functions associated with the display of the content on the display panel. The apparatus further includes a controller capable of adjusting one or more characteristics of the display panel based on the amount of ambient light measured by the light sensor. The integrated circuit and the photo-sensitive device may be formed on one side of a semiconductor wafer, and the photo-sensitive device may be exposed to the ambient light through an opening in an opposing side of the semiconductor wafer.

Apparatus and method for adjusting a display using an integrated ambient light sensor

A static random access memory cell comprising a storage latch having a first upper power supply voltage connection to a first bit line, a second upper power supply voltage connection to a second bit line, and a connection to a lower power supply voltage. A first access circuit connects the storage latch to the first bit line and a second access circuit connects the storage latch to the second bit line, wherein the storage latch is accessed utilizing the first access circuit and the second access circuit.

SRAM cell with p-channel pull-up sources connected to bit lines

A system for packaging integrated circuit components including a ball grid array substrate with a plurality of solder balls coupled to the substrate. A semiconductor device is mounted on the substrate and electrically coupled to the solder balls. One or more terminals are coupled to the substrate and electrically coupled to said semiconductor device. A detachable module contains auxiliary component, such as a data acquisition device, a wireless communications device, an output device or driving devices for a clock circuit. The module comprises a body portion for containing the component and one or more electrical connectors for mating with respective terminals to hold the module to the substrate and to electrically couple the component with the semiconductor device.

Detachable module/ball grid array package

According to the present invention, a structure and method provides for single bit failures of an integrated circuit memory device to be analyzed. According to the method for analyzing a single bit failure of an integrated circuit memory device, a test mode is entered, bitline load devices of the integrated circuit memory device are turned off, a single bit of the integrated circuit memory device is selected, the device is placed into a write mode, a plurality of bitlines true and a plurality of bitlines complement of the integrated circuit memory device not associated with the single bit are then set to a low logic level, the bitline true and the bitline complement associated with the single bit is connected to a supply bus and a supply complement bus which is connected to test pads. Finally, the electrical characteristics of the single bit can be monitored on the test pads. According to the structure of the present invention, bitline load devices of the integrated circuit memory device are controlled by a test mode signal, the state of which determines when the test mode will be entered. These bitline load devices are connected to the bitlines true and complement which in turn are connected to the memory cell. Select devices, such as column select transistors, are connected to the bitline true and bitline complement; they are also connected to driver circuitry by a bus, such as a write bus, a read bus or a write/read bus. The driver circuitry is supplied with supply voltages as well as data signals. Further, a buffer circuit allows bitlines true and bitlines complement not associated with the single bit being tested to be pulled to a logic low level. A dummy structure also provides the opportunity to directly monitor the bitlines of the integrated circuit memory device without the need for microprobing.

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Coppell, TX, United States of America

Frank J Sigmund