Finisar Corporation

Ii-vi Delaware, Inc.

Agilent Technologies, Inc.

Frank J Flens

William H Wang

Daniel Kossowski

Michael Joseph McReynolds, Jr

David C Lee

Chris Togami

Tat Ming Teo

Lucy G Hosking

Stephen T Nelson

Joshua Moore

Rafik Ward

Cindy Hsin-I Hsieh

Daniel Mahgerefteh

Gary D Sasser

Jimmy Alan Tatum

Darin James Douma

Shamei Shi

Cindy H Hsieh

Huaping Peng

Ziv Lipkin

Jia Lian

Henricus Jozef Vergeest

Kendra J Gallup

The′ Linh Nguyen

The' Linh Nguyen

A module mount interposer may include one or more fastener receivers configured to mechanically couple with one or more fasteners so as to mechanically and electrically couple a module to the interposer. The module mount interposer may also include a core configured to electrically couple with the module, wherein each of the fastener receivers are mechanically coupled to the core. The module mount interposer may additionally include a solder layer electrically coupled to the core and configured to electrically couple with a printed circuit board (PCB) so as to provide an electrical signal from the module to the PCB and to provide an electrical signal from the PCB to the module.

Module mount interposer

A transmitter can include: at least one primary laser emitter configured to emit primary laser light; at least one primary monitor photodiode optically coupled with the at least one primary laser emitter; and at least one spare laser emitter configured to emit spare laser light. Each spare laser emitter can be adjacent with a corresponding primary laser emitter such that a first primary laser emitter and a first spare laser emitter pair are directed through an optical system and out a common optical fiber.

Sparing configurations and protocols for parallel fiber optics

An optically enabled multi-chip module has an optical engine transceiver and a host system chip. The optical engine transceiver has an optical engine front-end and an optical engine macro. The optical engine front-end has multiple laser diodes, laser driver circuitry electrically interfaced with each of the laser diodes, multiple photodiodes, amplifier circuitry electrically interfaced with each of the photodiodes, and at least one optical element optically positioned between the laser diodes and at least one optical fiber and between the photodiodes and the at least one optical fiber. The at least one optical element optically interfaces the laser diodes and photodiodes with the optical fiber. The optical engine macro is both electrically interfaced with and physically segregated from the optical engine front-end. The optical engine macro provides a subset of optical transceiver functionality to the optical engine front-end. The host system chip is electrically interfaced with the optical engine transceiver.

Optically enabled multi-chip modules including optical engine macros

An example embodiment includes optoelectronic module. The optoelectronic module may include a lens assembly, a module board, heat-generating components, and a thermally conductive plate. The lens assembly may be secured to the module board. The module board may include a printed circuit board (PCB). The heat-generating components may be mounted to the PCB. The thermally conductive plate may be secured to a surface of the module board. The thermally conductive plate may define an opening that receives at least a portion of the lens assembly. The thermally conductive plate may be configured to absorb at least a portion of thermal energy generated during operation of the heat-generating components and to transfer the thermal energy away from the heat-generating components.

Thermal management structures for optoelectronic modules

A system may include a substrate and a lens component. The substrate may include pads and solder protuberances. Each solder protuberance may be located on a pad. The lens component may define grooves sized to receive at least a portion of the solder protuberances. The lens component may be positioned relative to the substrate such that at least a portion of each solder protuberance is positioned within the grooves.

Component alignment

A transceiver can include a transmitter and a receiver. The transmitter can include: a primary laser emitter; a primary monitor photodiode optically coupled with the laser emitter; a spare laser emitter; and a transmitter integrated circuit having a primary channel operably coupled with the primary laser emitter; a spare channel operably coupled with the spare laser emitter; a switch on the primary channel; and a secondary channel operably coupled with the switch and the spare channel. The receiver can include: a primary detector photodiode; a spare detector photodiode; and a receiver integrated circuit a primary receiver channel operably coupled with the at least one primary detector photodiode; a spare receiver channel operably coupled with the spare detector photodiode; a receiver switch on the spare receiver channel; and a secondary receiver channel operably coupled with the receiver switch and the primary receiver channel.

Communication devices are disclosed. In an example embodiment, a communication device may include a communication module including an illumination source and a body element. The body element may be configured to allow illumination generated by the illumination source to propagate within and illuminate at least a portion of an outer surface of the body element.

Communication devices including an illumination source and a physical input sensor

An optical fiber securing device may include a passage, an optical fiber seat, and a boundary portion. The passage may have an entrance and an exit, the passage configured to receive therein an optical fiber inserted through the entrance, as well as an epoxy. An epoxy path may be provided as a pathway between an epoxy well and the passage. The optical fiber seat may be configured to receive at least a portion of the optical fiber, the optical fiber seat configured to position an end of the optical fiber in optical alignment with a lens. The boundary portion may define an upper boundary of the passage at the exit of the passage, and is configured to restrain epoxy received within the passage such that the epoxy does not become interposed between the end of the optical fiber and the lens.

Optical fiber securing device

A connector includes pins having a pinout including a functional designation cadence. The functional designation cadence includes a first ground pin, a first signal pin, a no-connect pin, a second signal pin, and a second ground pin, where the first signal pin is positioned between the first ground pin and the no-connect pin, the no-connect pin is positioned between the first and second signal pins, and the second signal pin is positioned between the no-connect pin and the second ground pin. Alternately, the functional designation cadence includes a first ground pin, a first signal pin, a third ground pin, a second signal pin, and a second ground pin, where the first signal pin is positioned between the first and third ground pins, the third ground pin is positioned between the first and second signal pins, and the second signal pin is positioned between the third and second ground pins.

Pin cadence for high-speed connectors

Optically enabled multi-chip modules

Growing community of inventors

Campbell, CA, United States of America

Frank J Flens