Robert Boschgmbh

Frank Henning

Christoph Schelling

Hubert Benzel

Stefan Pinter

Hans Artmann

Michael Offenberg

Jochen Franz

Helmut Baumann

Frank Reichenbach

Georg Bischopink

Franz Laemer

Armin Scharping

Frank Fischer

Wilhelm Frey

Holger Scholzen

Oliver Kohn

Matthias Illing

Peter Hein

Matthias Maute

Rálf Henn

A micromechanical component including a first composite of a plurality of semiconductor chips, the first composite having a first front and back surfaces, a second composite of a corresponding plurality of carrier substrates, the second composite having a second front and back surfaces; wherein the first front surface and the second front surface are connected via a structured adhesion promoter layer in such a way that each semiconductor chip is connected, essentially free of cavities, to a corresponding carrier substrate corresponding to a respective micromechanical component.

Manufacturing method for a micromechanical component, corresponding composite component, and corresponding micromechanical component

A construction concept for high-pressure sensors is provided, which enables simple and economical production of reliable high-pressure sensors even for pressure ranges above 2200 bar. A high-pressure sensor of this kind encompasses a sensor element for pressure sensing and a connector piece for coupling the sensor element to a system to be measured. A diaphragm is embodied in the base element of the sensor element, and a pressure conduit is embodied in the base element of the connector piece. The sensor element is mounted on the connector piece so that the pressure to be measured is able to act upon the diaphragm via the pressure conduit. Firstly the base element of the sensor element is mounted on the base element of the connector piece, a full-area connection being generated between the mounting surfaces of the two base elements. Only thereafter is the pressure conduit configured in the connector piece, and the diaphragm of the sensor element exposed.

Method for producing high-pressure sensors

A manufacturing method for a micromechanical component, a corresponding composite component, and a corresponding micromechanical component are described. The method has the following steps: providing a first composite of a plurality of semiconductor chips, the first composite having first front and back surfaces; providing a second composite of a corresponding plurality of carrier substrates, the second composite having second front and back surfaces; imprinting a structured adhesion promoter layer on the first front and/or second front surfaces, the layer having degassing channels; aligning the first front and second front surfaces corresponding to a plurality of micromechanical components, each having a semiconductor chip and a corresponding carrier substrate; connecting the first front and second front surfaces via the structured adhesion promoter layer by applying pressure so that a gas from the ambient atmosphere is able to escape to the outside through the degassing channels; and separating the micromechanical components.

A sensor system includes a sensor element and a body. A number of electrical contact points with which contact may be created via electrical contact elements are provided on one side of the sensor element. Electrically conductive insertion parts are introduced into the body made of a non-conductive material and create a contact with the electrical contact points of the sensor element when the sensor element and the body are mechanically joined together.

Space-optimized sensor connector

The invention relates to a sensor with at least one silicon-based micromechanical structure, which is integrated with a sensor chamber of a foundation wafer, and with at least one covering that covers the foundation wafer in the region of the sensor chamber, and to a method for producing a sensor. It is provided that in the sensor of the invention, the covering () comprises a first layer () (deposition layer) that is permeable to an etching medium and the reaction products, and a hermetically sealing second layer () (sealing layer) located above it, and that in the method of the invention, at least the sensor chamber () present in the foundation wafer () after the establishment of the structure () is filled with an oxide (), in particular CVD oxide or porous oxide; the sensor chamber () is covered by a first layer () (deposition layer), in particular of polysilicon, that is transparent to an etching medium and the reaction products or is retroactively made transparent; the oxide () in the sensor chamber () is removed through the deposition layer () with the etching medium; and next, a second layer () (sealing layer), in particular of metal or an insulator, is applied to the deposition layer () and hermetically seals off the sensor chamber ().

Sensor with at least one micromechanical structure, and method for producing it

A sensor has a foundation wafer having a sensor chamber, at least one silicon-based micromechanical structure integrated with the sensor chamber of the foundation wafer, at least one covering that covers the foundation wafer in a region of the sensor chamber, the covering including a first layer which is a deposition layer and is permeable to an etching medium and reaction products, and a hermetically sealing second layer which is a sealing layer and located above the first layer, the deposition layer which is the first layer being permeable in a region of the sensor chamber to the etching medium and a reaction product, the deposition layer for being permeable having structures selected from the group consisting of etching openings, porous regions, and both.

Sensor with at least one micromechanical structure and method for production thereof

For a sensor whose sensor structure is implemented in a micromechanical structural component and which has parts which are movable in relation to the stationary substrate of the structural component, and which also includes an unsupported a seismic mass, a spring system having at least one spring, the seismic mass being connected to the substrate through the spring system, and an overload protection to limit the deflection of the spring system and the seismic mass in at least one direction, and an arrangement for detecting the deflections of the spring system and the seismic mass, whereby the impact forces may be reduced to prevent conchoidal breaks and resulting incipient damage to the sensor structure, as well as formation of particles. To that end, at least one two-dimensional stop for at least one moving part of the sensor structure is provided as overload protection. Alternatively or in addition thereto, at least one spring or resilient stop for at least one moving part of the sensor structure is provided as overload protection.

Sensor

A micromechanical structure and a corresponding manufacturing method. The structure includes a substrate, which includes an anchoring device, and a centrifugal mass, which is connected to the anchoring device via a flexible spring device, so that the centrifugal mass is elastically deflectable from its rest position. The centrifugal mass includes clearances and is configured to be deflectable by etching a sacrificial layer underneath it. The sacrificial layer is present in a first area located underneath the centrifugal mass with a first etchable thickness, and in a second area located underneath the centrifugal mass with a second etchable thickness, the second thickness is greater than the first thickness. The centrifugal mass is structured in the first area so that in etching only a maximum of two etching fronts may come together in order to limit the etching residue deposits.

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Reutlingen, Germany

Frank Henning