Infinera Corporation

Avago Technologies Fiber IP (Singapore) Pte. Ltd

Other

Agilent Technologies, Inc.

Avago Technologies General IP (Singapore) Pte. Ltd.

Avago Technologies Limited

Frank H Peters

Charles H Joyner

Fred A Kish, Jr

Radhakrishnan L Nagarajan

Mark Missey

David F Welch

Richard P Schneider

Vincent G Dominic

Atul Mathur

Stephen G Grubb

Ting-Kuang Chiang

Alan C Nilsson

Robert B Taylor

Matthew L Mitchell

Drew Daniel Perkins

Jonas Webjorn

Mehrdad Ziari

Marco Sosa

Ken A Nishimura

Jonathan Noah Simon

Brian Elliot Lemoff

Scott W Corzine

Gary B Gordon

Kirk S Giboney

Michael H Leary

Donald J Pavinski

Lisa Anne Buckman

Laura M Giovane

Andrew G Dentai

Sheila K Mathis

Hao-chung Kuo

Fred A Kish

Kit Cham

An-Nien Cheng

Robert Grencavich

Yoon-Kyu Song

Damien Jean Henri Lambert

Vinh D Nguyen

Donald J Pavinski, Jr

Frederick A Kish, Jr

Mark J Missey

Marco E Sosa

A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Transmitter photonic integrated circuit (TxPIC) chip

A low cost, high speed, short haul, optic interconnect and data link which employs an array of vertical cavity surface emitting laser (VCSEL) arrays through which several optical signals are simultaneously transmitted through collimating optics that generate multiple, multiple-wavelength optical signals. Each combined optical signal is transmitted to a receiver array comprising a plurality of optical filters and photodetector arrangements that have a number of sections, each having an optical filter to pass a specific optical wavelength, and a mating photodetector element to convert the specific optical signal to an electrical signal. The signals may be coupled between the transmitter array and the receiver array through free space or through optical fibers.

Structure and apparatus for a very short haul, free space, and fiber optic interconnect and data link

Transmitter photonic integrated circuit (TxPIC) chips

Method and apparatus for utilizing a probe card for testing in-wafer photonic integrated circuits (PICs) comprising a plurality of in-wafer photonic integrated circuit (PIC) die formed in the surface of a semiconductor wafer where each PIC comprises one or more electro-optic components with formed wafer-surface electrical contacts. The probe card has a probe card body with at least one row of downwardly dependent, electrically conductive contact probes. The probe body is transversely translated over the surface of the wafer to a selected in-wafer photonic integrated circuit (PIC) die. Then, the contact probes of the probe card are brought into engagement with surface electrical contacts of the selected photonic integrated circuit (PIC) die for testing the operation of electro-optic components in the selected in-wafer photonic integrated circuit (PIC) die.

Probe card for testing in-wafer photonic integrated circuits (PICs) and method of use

Monolithic transmitter photonic integrated circuit (TXPIC) with a transversely disposed output

A monolithic optical transmitter photonic integrated circuit (TxPIC) comprises a plurality of integrated modulated sources which, when all operated at constant current, display a power output that varies as a function of array position similar to a quadratic-shaped curve and, further, forming an array of signal channels each having a different wavelength output. An optical combiner/decombiner is integrated in the circuit and has at least one free space region with a plurality of ordered bands along its edge where the zero order band is substantially at a longitudinal centerline of the free space region and where, on either side of this band, is a first order band followed by additional higher order bands. The ends of the output waveguides from the modulated sources are coupled approximate to the free space region edge along a region of the zero order band between one of the adjacent first order bands and a longitudinal centerline of the zero order band so that the inputs of the signal channels to the combiner of are titled or offset with respect to the longitudinal centerline of the combiner free space region so the combined outputs from the optical combiner will be aligned along the slope of the quadric-shaped curve of the combiner output passband envelope. The tilted combiner/decombiner may also be deployed in a receiver photonic integrated circuit (RxPIC) or other circuit employing such a device.

Tilted combiners/decombiners and photonic integrated circuits (PICs) employing the same

Monolithic transmitter photonic integrated circuit (TxPIC) with a traversely disposed output

An optical equalizer/dispersion compensator (E/CDC) comprises an input/output for receiving a multiplexed channel signal comprising a plurality of channel signals of different wavelengths. An optical amplifier may be coupled to receive, as an input/output, the multiplexed channel signals which amplifier may be a semiconductor optical amplifier (SOA) or a gain clamped-semiconductor optical amplifier (GC-SOA). A variable optical attenuator (VOA) is coupled to the optical amplifier and a chromatic dispersion compensator (CDC) is coupled to the variable optical attenuator. A mirror or Faraday rotator mirror (FRM) is coupled to the chromatic dispersion compensator to reflect the multiplexed channel signal back through these optical components The E/CDC components may be integrated in a photonic integrated circuit (PIC) chip.

Chromatic dispersion compensator (CDC) in a photonic integrated circuit (PIC) chip and method of operation

Photonic integrated circuit (PIC) chips

A frequency modulated (FM) vertical cavity surface emitting laser (VCSEL). The frequency modulated VCSEL includes a mirror region that has an active region. The frequency modulated VCSEL also includes a phase adjustment region for use in altering the characteristics of the VCSEL. For example, by changing the index of refraction in the phase adjustment region, the wavelength of the VCSEL can be changed, resulting in frequency modulation.

Frequency modulated vertical cavity laser

Transmitter photonic integrated circuits (TxPIC) and optical transport networks employing TxPICs

An optical transport network comprises a monolithic transmitter photonic integrated circuit (TxPIC) InP-based chip and a monolithic receiver photonic integrated circuit (RxPIC) InP-based chip.

Optical transport network

A method is disclosed for optimizing optical channel signal demultiplexing in a monolithic receiver photonic integrated circuit (RxPIC) chip by providing an integrated channel signal demultiplexing with multiple waveguide input verniers provided to an WDM signal demultiplexer. The RxPIC chip may optionally include an integrated amplifier in at least some of the waveguide input verniers. The RxPIC chip may be comprised of, in monolithic form, a plurality of optional semiconductor optical amplifiers (SOAs) at the input of the chip to receive a WDM signal from an optical link which is provided along a plurality of waveguide input verniers to an integrated optical demultiplexer, such as, but not limited to, an arrayed waveguide grating (AWG), as a WDM signal demultiplexer. Thus, optical outputs from the respective semiconductor laser amplifiers are provided as vernier inputs to the optical demultiplexer forming a plurality of input verniers at the input to the optical demultiplexer. One of the vernier inputs to the chip is selected for operation in the RxPIC chip that corresponds to an optimum performance in matching a WDM channel signal wavelength grid of the received WDM signal to a wavelength grid of the on-chip optical demultiplexer.

Method of optimizing optical channel signal demultiplexing in a monolithic receiver photonic integrated circuit (RxPIC)

Disclosed is a method of in-wafer testing of integrated optical components and in-wafer chips with photonic integrated circuits (PICs).

In-wafer testing of integrated optical components in photonic integrated circuits (PICs)

Growing community of inventors

San Jose, CA, United States of America

Frank H Peters