Lumileds LLC

Frank Giese

Matthias Daniel Epmeier

Petra Wellmeier

Carsten Weber

Georg Henninger

Michael Deckers

Floris Maria Hermansz Crompvoets

Joseph Hendrik Anna Maria Jacobs

Marcus Jozef Henricus Kessels

Marc Droegeler

Matthias Holtrup

Thorsten Erich Lenzen

Matthias Epmeier

A lighting device for mounting to an optical element includes a center ring, a heat sink, at least one housing part and at least one fan. The center ring has a first side and a second side and includes a mechanical interface for mechanically coupling the center ring to the optical element. The heat sink includes a lighting module mounting part for connection with at least one relative to the center ring with the entire at least one hollow structure over the first side of the lighting module and at least one hollow structure within the heat sink. The heat sink is positioned center ring. The at least one fan includes at least one blade and a driver. At least a portion of the at least one fan is contained within the at least one housing part with the at least one blade within the at least one hollow structure.

Lighting device for mounting to an optical element having a mounting ring, heat sink with a hollow structure and fan

A lighting device comprises a support comprising a mounting section having at least one mounting face. The at least one mounting face has an arrangement direction and comprising at least two contact sections along the arrangement direction. The support further comprises a body section adjacent to the mounting section. The support further comprises a plurality of layered conductors connecting the body section to the at least one mounting face. The lighting device comprises at least one light-emitting element mounted along the arrangement direction of the at least one mounting face such that the at least one light-emitting element is in electrical contact to the at least two contact sections.

Support for light-emitting elements and lighting device

An LED module includes a heat sink. The heat sink has a mounting surface that defines, with respect to ambient light incident thereon, one main direction of a beam perpendicular to the mounting surface and secondary directions of the beam inclined to the main direction of the beam at angles having absolute values smaller than or equal to 90 degrees. The heat sink also has a reflection surface oriented such that, with respect to the ambient light incident on thereon, a main direction of the beam of the reflection surface is perpendicular to the reflection surface and points in a direction included in the angle range determined by the main direction of the beam of the mounting surface and the secondary directions of the beam of the mounting surface. The LED module further includes an LED light source on the mounting face and pigments on the reflection surface.

LED module, LED module and reflector arrangement, and vehicle headlamp

A support for light-emitting elements is disclosed. The support comprises a mounting section comprising at least one mounting face. The at least one mounting face has an arrangement direction and is configured to accommodate at least one light-emitting element along the arrangement direction. The support comprises a body section adjacent to the mounting section and having a length that extends parallel to the arrangement direction. The body section protrudes sidewards from the at least one mounting face. The support comprises a plurality of conductors connecting the body section to the at least one mounting face. Each contact section corresponds to a conductor. The plurality of conductors are a layered structure of conductors. An extension direction of the layered structure of the conductors extends substantially perpendicular to the arrangement direction of the at least one mounting face. The layered structure of conductors comprises an angled section.

A lighting device, a method of manufacturing a lighting device and a support are described. A support includes a layered structure of alternating conductors and insulating layers. The layered structure includes a mounting section and a body section adjacent the mounting section. The mounting section includes at least one mounting face that has an arrangement direction and at least three alternating contact sections along the arrangement direction. Each contact section is electrically coupled to one of the conductors and separated from a neighboring one of the contact sections by one of the insulating layers. The body section has a width that protrudes sidewards from the at least one mounting face and a length that extends substantially parallel to the arrangement direction.

A method for applying at least one electronic component to a surface is described. The method includes placing a component stencil on a support. At least one electronic component is arranged in a corresponding opening of the component stencil with a top surface of the electronic component on the support. A contact material stencil is positioned on the component stencil such that at least one opening in the contact material stencil is over a corresponding contact region on the bottom surface of the at least one electronic component. A contact material is applied on the at least one contact region of the at least one electronic component within the corresponding opening of the contact material stencil. The contact material stencil is removed from the component stencil. The component stencil is removed from the support. The at least one electronic component is applied to the surface.

Growing community of inventors

Aachen, Germany

Frank Giese