Electro Scientific Industries, Inc.

Frank G Evans

Kelly Bruland

Brian W Baird

Ho Wai Lo

Stephen Neal Swaringen

Leo Benedict Baldwin

Patrick Leonard

Mark Singer

Victor Scarpine

Methods and systems selectively irradiate structures on or within a semiconductor substrate using a plurality of laser beams. The structures are arranged in a row extending in a generally lengthwise direction. The method generates a first laser beam that propagates along a first laser beam axis that intersects the semiconductor substrate and a second laser beam that propagates along a second laser beam axis that intersects the semiconductor substrate. The method simultaneously directs the first and second laser beams onto distinct first and second structures in the row. The method moves the first and second laser beam axes relative to the semiconductor substrate substantially in unison in a direction substantially parallel to the lengthwise direction of the row, so as to selectively irradiate structures in the row with one or more of the first and second laser beams simultaneously.

Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously

Methods and systems selectively irradiate structures on or within a semiconductor substrate using a plurality of laser beams. The structures are arranged in a row extending in a generally lengthwise direction. The method generates a first laser beam that propagates along a first laser beam axis that intersects the semiconductor substrate and a second laser beam that propagates along a second laser beam axis that intersects the semiconductor substrate. The method directs the first and second laser beams onto non-adjacent first and second structures in the row. The method moves the first and second laser beam axes relative to the semiconductor substrate along the row substantially in unison in a direction substantially parallel to the lengthwise direction of the row.

Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures

Methods and systems selectively irradiate structures on or within a semiconductor substrate using a plurality of pulsed laser beams. The structures are arranged in a row extending in a generally lengthwise direction. The method generates a first pulsed laser beam that propagates along a first laser beam axis that intersects the semiconductor substrate and a second pulsed laser beam that propagates along a second laser beam axis that intersects the semiconductor substrate. The method directs respective first and second pulses from the first and second pulsed laser beams onto distinct first and second structures in the row. The method moves the first and second laser beam axes relative to the semiconductor substrate substantially in unison in a direction substantially parallel to the lengthwise direction of the row.

Semiconductor structure processing using multiple laser beam spots

Methods and systems selectively irradiate structures on or within a semiconductor substrate using a plurality of laser beams. The structures are arranged in a row extending in a generally lengthwise direction. The method generates a first laser beam that propagates along a first laser beam axis that intersects the semiconductor substrate and a second laser beam that propagates along a second laser beam axis that intersects the semiconductor substrate. The method directs the first and second laser beams onto distinct first and second structures in the row. The second spot is offset from the first spot by some amount in a direction perpendicular to the lengthwise direction of the row. The method moves the first and second laser beam axes relative to the semiconductor substrate along the row substantially in unison in a direction substantially parallel to the lengthwise direction of the row.

Semiconductor structure processing using multiple laser beam spots spaced on-axis with cross-axis offset

The present invention provides for methods and an apparatus for evaluating objects having three dimensional features. One method involves using both two dimensional data sets to improve the processing of three dimensional data sets. The two dimensional data set can be used to pre-qualify the three dimensional data set, or may be used to locate that data within the three dimensional data set that is characteristic of the three dimensional feature. The invention may include a sensor configured to capture both three dimensional and two dimensional data. The present invention provides for an efficient technique to evaluate three dimensional data. The present invention also solves heretofore unrecognized problems associated with geometric distortion.

Method and apparatus for evaluating integrated circuit packages having three dimensional features

A method and apparatus for characterizing pixels in an image of an object surface by providing at least two images of the surface wherein each pixel has a unique location common to all of the images; comparing each pixel value at each location to an identification matrix; and identifying the region in which each pixel is located based on the comparison. The matrix can comprise a plurality of non-pixel values representing one or more regions, each of the regions defining at least one surface attribute. One embodiment provides at least two references images of a template using the same technique used to obtain each image of the surface, and creating the matrix using the reference images. Providing at least two images comprises providing a first and second image, wherein the surface is illuminated using a first and second source of illumination, or providing the first using a source of illumination and providing the second from the first.

Automatic separation of subject pixels using segmentation based on multiple planes of measurement data

A calibration system within an optical inspection apparatus comprising a sensor, lens, fiducials, and a CPU. The CPU is configured to receive information from the sensor relating to the fiducial coordinate system and the sensor coordinate system, and the fiducials are used to determine a physical relationship between the sensor coordinates and fiducial coordinates. The calibration system has a means for calibrating the inspection system and measuring critical dimensions of an object in an accurate manner on-the-fly without additional set-up or manual calibration of the system.

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Dundee, OR, United States of America

Frank G Evans