Semblant Global Limited

Microgen Engine Corporation Holding B.v.

Europlasma Nv

Semblant Limited

Precision Grinding Limited

Frank Ferdinandi

Rodney Edward Smith

David Anthony Clark

Heather Allderidge

Filip Legein

Wayne Kenneth Aldridge

John H Fisher

Christopher John Spenceley

Adrian Robin Richardson

Nigel Graham Moore

Alan William McCarthy-Wyper

A plasma chamber (') for coating a substrate with a polymer layer, the plasma chamber includes a first electrode set (&#x2032;) and a second electrode set (&#x2032;), the first and second electrode sets are arranged either side of a sample chamber for receiving a substrate, wherein the first and second electrode sets include plural electrode layers (&#x2032;) and wherein each electrode set includes plural radiofrequency electrode layers or plural ground electrode layers for coating polymer to each surface of a substrate.

Surface polymer coatings

A method including: attaching a plurality of conductive tracks to at least one surface of a substrate, depositing a coating comprising at least one halo-hydrocarbon polymer on the at least one surface of the substrate, and soldering through the coating.

Method for manufacturing printed circuit boards

In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.

Apparatus with a multi-layer coating and method of forming the same

Apparatus with a wire bond and method of forming the same

A printed circuit board to which a localised solder connection is to be made, the surface of said printed circuit board having a continuous or non-continuous coating of a composition comprising a halo-hydrocarbon polymer at a thickness of from 1 nm to 10 &#x3bc;m.

Printed circuit boards

This invention relates to domestic heat and power systems that allow efficient methods of operating a domestic combined heat and power (dchp) unit and to energy-efficient methods of scheduling domestic appliance operation within a household having a dchp unit. Dchp units provide heating and hot water for the home and also generate electricity for use in the home. A domestic heat and power system is provided that comprises a dchp unit, a dchp unit controller, a programmer module and an energy scheduler linked to allow communication therebetween, wherein the programmer module receives data input and generates a heating and/or hot water schedule therefrom, the dchp unit controller determines operating times of the dchp unit in accordance with the schedule and provides the operating times to the energy scheduler that then operates the domestic appliance during operating times.

Domestic heat and power system

Apparatus for use in monitoring a plurality of variables includes a respective transducer arranged to detect a variation in a parameter and to provide an electrical output signal representative thereof and means to couple a signal associated with the output of a transducer to a display either under the control of a manually operated switching arrangement or an automatic scanning arrangement which identifies a detected variation and causes it to be displayed.

Growing community of inventors

Cambridge, United Kingdom

Frank Ferdinandi