Motorola Corporation

Frank E Polka

Victor J Adams

Brian A Webb

Theodore R Golubic

A single-in-line semiconductor package uses a multi-level heatsink having patterned conductors surrounding the semiconductor device. The patterned conductors are electrically isolated from the heatsink. Short bond wires are used to connect the semiconductor device to the patterned conductors. This arrangement eliminates the need for bonding shelves when bonding the leads and also increases the resistance of the bond wires from being swept away during encapsulation.

Multi-level semiconductor package

A method for dispensing viscous materials is described in which a quill having a fluted insert comprise end portions having a small radius of curvature. The viscous material is extruded from the collet, brought into contact with the article on which the material is to be deposited, and then removed leaving a hollow figure of material having approximately the same shape as the cross-section of the quill.

Method of forming a ring of viscous material against a substrate

An improved collet and method for dispensing viscous materials is described in which a quill having a fluted insert comprise end portions having a small radius of curvature. The viscous material is extruded from the collet, brought into contact with the article on which the material is to be deposited, and then removed leaving a hollow figure of material having approximately the same shape as the cross-section of the quill.

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Phoenix, AZ, United States of America

Frank E Polka