Amp LLC

Frank C Youngfleish

William S Scheingold

Steven J Kandybowski

Gabriel B Cherian

Ned E Corman

Harold Lawrence Purdy

The present invention is to a heat sink device designed to conduct heat away from an active device substrate housed in a connector of the type having a hinged cover with spring elements thereon. More particularly the preferred embodiment includes a base member, in intimate contact with the substrate, positioned on the inside of the cover, and a heat exchanger attached to the base and extending above the cover.

Active device substrate connector having a heat sink

The present invention relates to a connector of the type for electrically connecting an active device substrate unit for a PCB (printed circuit board). More particularly, the invention includes a dual-contact spring member having a buffer section so that forces exerted on one contact are not transmitted to the other contact.

Active device substrate connector

The subject invention relates to a connector for electrically connecting a leadless electronic package to a printed circuit board. More particularly, the connector includes a frame-shape housing containing terminals having a circular contact section which engages the pads on the package. A clamp plate is also disclosed which secures the package and connector to the printed circuit board.

Connector for a leadless electronic package

The present invention relates to a connector for connecting a semi-conductor chip carrier to a printed circuit board (PCB). More particularly, the invention comprises an insulating housing and a plurality of contact-bearing spring members positioned around the periphery of a central compartment in the housing. The spring member connects the leads on the chip package to traces on the PCB.

Surface to surface connector

The present invention relates to spring members positioned in an insulated housing for providing an electrical path from leadless integrated circuit package to a printed circuit board. More particularly the spring members are uniquely constructed in a complex geometric shape to exert forces on contact mating surfaces within closely specified maximum and minimum values and not distort the housing or the printed circuit board.

Contact carrying spring member

This invention relates to an interconnector for retaining two vertically stacked electronic packages or the like and for electrically connecting them to a printed circuit board. More particularly the interconnector consists of a housing of insulating material and a plurality of contact members spaced around the sides of the housing. Each contact member contains two integral yet independently flexible contacts for engaging the stacked packages. In addition each contact member contains a single pin for printed circuit board interconnection.

Interconnection for electrically connecting two vertically stacked

This invention relates to a device which electrically connects a leadless integrated circuit package to a printed circuit board. More particularly, the device includes a square frame having a plurality of contacts arranged along each side of the housing. The lower end of the contact electrically engages a circuit on the printed circuit board and the upper end electrically engages a circuit on the package. The frame further contains positioning and support clips which permits alignment of the package before engagement is made with the contacts.

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Harrisburg, PA, United States of America

Frank C Youngfleish