Ford Motor Company Limited

Visteon Global Technolgoies, Inc.

Frank Burke DiPiazza

Vivek Amir Jairazbhoy

Marc Alan Straub

Lakhi Nandial Goenka

Randy Claude Stevenson

Jay DeAvis Baker

Cuong Van Pham

An interposer,for electrically coupling a semiconductor die,to a substrate,, comprising: an interposer body,made of a dielectric material and having a contact surface,and an opposed bonding surface,; a plurality of contact pads,arranged about the periphery of the contact surface,; a plurality of bonding pads,arranged across generally the entire area of the bonding surface,; and a plurality of electrically conductive conduits,disposed generally within the interposer body, such that each conduit,connects a respective one of the contact pads,with a respective one of the bonding pads,. The interposer,may also include: a sealed cooling channel,defined within the interposer body,; a fluid medium,generally filling the cooling channel,; and a piezoelectric element,attached to the interposer body such that the piezoelectric element communicates with the cooling channel,and the fluid medium,, the piezoelectric element being operatively coupled to at least two of the electrically conductive conduits

Interposer for mounting semiconductor dice on substrates

An apparatus for dispensing solder includes a nozzle body having a plurality of flow channels formed therein. Each flow channel includes an inlet end and a dispenser end for dispensing solder. The nozzle body forms a nipple surrounding each dispenser end, and the nozzle body further forms a shielding chamber in communication with each dispenser end for protecting the respective nipple, and optionally providing flow of inerting gas and/or excluding ambient oxygen from the soldering area. The nozzle bodies comprise micro-machined silicon. Various flow channel configurations are provided for improved flow characteristics.

Molten solder dispensing system

Growing community of inventors

Highland, MI, United States of America

Frank Burke DiPiazza