Atotech Deutschland Gmbh

Frank Brüning

Heiko Brunner

Birgit Beck

Johannes Etzkorn

Michael Merschky

Jörg Schulze

Bexy Dosse

Kay Wurdinger

Christian Lowinski

Richard Nichols

Don Jang

Harald Riebel

Elisa Langhammer

Anna Peter

Constanze Donner

Therese Stern

Tobias Bernhard

Taybet Bilkay

Günther Bauer

Lutz Brand

The present invention discloses a method for electroless plating of a metal or metal alloy onto a metal or a metal alloy structure comprising a metal such as molybdenum or titanium and alloys containing such metals. The method comprises the steps of activation, treatment in an aqueous solution comprising at least one nitrogen-containing compound or a hydroxy carboxylic acid and electroless plating of a metal or metal alloy.

Method for electroless plating

The present invention relates to a method for manufacture of fine line circuitry in the manufacture of printed circuit boards, IC substrates and the like. The method utilizes a first conductive layer on the smooth surface of a build-up layer and a second conductive layer selected from electrically conductive polymers, colloidal noble metals and electrically conductive carbon particles on the roughened walls of at least one opening which are formed after depositing the first conductive layer.

Method for manufacture of fine line circuitry

The invention relates to an electroless aqueous copper plating solution, comprising: a source of copper ions, a reducing agent or a source of a reducing agent, and a combination of complexing agents comprising i) polyamino disuccinic acid, polyamino monosuccinic acid, or a combination thereof, and ii) one or more of ethylenediamine tetraacetic acid, N'-(2-Hydroxyethyl)-ethylenediamine-N,N,N&#x2032;-triacetic acid, and N,N,N&#x2032;,N&#x2032;-Tetrakis (2-hydroxypropyl)ethylenediamine, as well as methods for electroless copper plating utilizing the solution and uses of the solution for the plating of various substrates.

Electroless copper plating solution

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Berlin, Germany

Frank Brüning