Telefonaktiebolaget Lm Ericsson (publ)

Frank B&auml;uerlein

Walter Kodim

The invention relates to an electrical component (CO) as well as a device (DEV) comprising such an electrical component (CO) and an electric circuit module (MO). A ground plane (,) of the component (CO) and a ground plane (,) of the circuit module (MO) are brought into contact via projections (,&Prime;) provided on the ground plane (,) of the component (CO) and/or on the ground plane of the circuit module (MO). The provision of the projections (,&Prime;) and the recesses (,&prime;) therebetween provide heat sinks between the projections (,&Prime;) when they are soldered to the ground plane (,) of the circuit module (MO). Through-holes (,&prime;) and additional non-ground conductors (,&prime;) can be provided between pads (,) of the ground plane (,) of the circuit module (MO) allowing an efficient use of the available space. The invention is particularly useful when a patch antenna needing a large ground plane is connected to a multilayer circuit board. Another embodiment of the invention comprises a plurality of spacer elements which are arranged between the ground planes (,) of the circuit module (MO) and of the component (CO), such that the ground planes (,) can be kept flat. This allows a design of the configuration of the ground plane of the circuit module (MO) independently from a configuration of the component (CO).

Growing community of inventors

Winkelhaid, Germany

Frank Bäuerlein

Growing community of inventors

Winkelhaid, Germany

Frank B&auml;uerlein

Frank Bäuerlein