Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Other

Frank Ansorge

Elke Zakel

Paul Kasulke

Rolf Aschenbrenner

Andreas Ostmann

Lothar Dietrich

Christine Kallmayer

Christian Rebholz

Kathrin Badstübner

Gabriele Wegerer

The invention relates to a method for producing a functional assembly as well as a functional assembly. According to the inventive method, at least one first material and a second material which are provided with different properties are applied layer by layer, partially in some parts, so as to create an encapsulation from the first material and a strip conductor structure from the second material, one or several functional units being embedded in the layer structure and being contacted with the strip conductor structure when the materials are applied. The disclosed method makes it possible to carefully structure a unit while offering a great degree of creative freedom.

Method for the production of a functional constructional unit, and functional constructional unit

A chip module comprises a chip with a chip contact, an insulating structure, which covers the chip and the chip contact at least partly, and a spare contact at an external surface of the insulating structure and a conductive trace for electrically connecting the chip contact to the spare contract.

Chip module and method for producing a chip module

The present invention relates to a method of producing a contactless chip card. In a first step of the method, a card body with one or a plurality of recesses on one card body side is produced from a theremoplastic material, preferably by injection moulding. Bumps being formed on the base surface of the recesses. Subsequently, conductor tracks corresponding to a coil as a conductor track pattern are impressed directly onto surface areas of the card body side including the recesses using a hot impressing technique. The conductor tracks are impressed especially also onto surface areas inside the recesses such that same extends across the bumps. One or a plurality of chips are then aligned in the recesses and contacted with the conductor tracks in the recesses which extend across the bumps. The method according to the present invention is advantageous insofar as it permits a simple production of a chip card, which requires only a few method steps and is therefore also economical. Furthermore, such a chip card is both mechanically stable and reliable, since it comprises very few individual layers and since the conductor tracks of the coil are applied directly to the card body.

Method for producing contactless chip cards and corresponding contactless chip card

Method and apparatus for the testing of substrates which are provided with a wiring structure, in particular, chips (,), in conjunction with which, by means of a solder-deposit carrier (,) which is provided with a structured, electrically conductive coating (,) with bond pads (,) for the arranging of solder deposits (,) and their transfer to correspondingly arranged bond pads (,) of a substrate (,), an electrical check of the wiring structure of the substrate (,) takes place during the transfer of the solder deposits (,).

Method and apparatus for testing chips

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Berlin, Germany

Frank Ansorge